公开(公告)号：US20240426557A1

公开(公告)日：2024-12-26

申请号：US18620162

申请日：2024-03-28

Applicant: Hanon Systems

Inventor： Evangelos Papoulis ,  Chao Zhang ,  Nicos Agathocleous ,  William Abate ,  Kenneth Belford ,  Robert Sorensen

IPC: F28D9/00

Abstract: A heat exchanger comprising a plurality of first plates and a plurality of second plates disposed between two end plates. The first plates and the second plates are alternatingly arranged in a stacked relationship. When in the stacked relationship, the first and second plates form at least a first flow path for a first fluid/medium, a second flow path for a second fluid/medium, and a third flow path for a third fluid/medium.

公开(公告)号：US20240426562A1

公开(公告)日：2024-12-26

申请号：US18641387

申请日：2024-04-21

Applicant: Hanon Systems

Inventor： Evangelos Papoulis ,  Chao Zhang ,  Nicos Agathocleous ,  Amey Sawant ,  Kenneth Belford ,  Robert Sorensen

IPC: F28F3/08 ,  F28F3/00 ,  F28F9/02

Abstract: A thermal management module comprising a heat exchanger and an expansion valve assembly is disclosed. The heat exchanger includes a plurality of first plates and a plurality of second plates disposed between two end plates. The first and second plates are alternatingly arranged in a stacked relationship. A divider plate is disposed between one of the first plates and an adjacent one of the second plates to divide the heat exchanger into a first portion (e.g., internal heat exchanger) and a second portion (e.g., chiller). When in the stacked relationship, the plates define at least a first flow path for a relatively high-pressure, high-temperature first fluid from a first circuit (e.g., a liquid refrigerant), a second flow path for a relatively low-pressure, low-temperature first fluid from the first circuit (e.g., liquid refrigerant), and a third flow path for a second fluid from a second circuit (e.g., coolant).