THERMAL FUSE EMISSIVITY IMPROVEMENT
    2.
    发明申请

    公开(公告)号:US20200088246A1

    公开(公告)日:2020-03-19

    申请号:US16244539

    申请日:2019-01-10

    Applicant: Hanon Systems

    Abstract: A thermal fuse includes a casing wall configured to transfer heat energy generated exterior to the casing wall to a thermally activated device disposed in an interior of the casing wall. The thermally activated device is configured for activation at a preselected temperature. The casing wall includes a coating layer disposed on an adjacent layer. The coating layer forms an outermost surface of the casing wall and has an emissivity greater than the adjacent layer of the casing wall.

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