Process for partially electroplating flat silver
    2.
    发明授权
    Process for partially electroplating flat silver 失效
    局部电镀平银的工艺

    公开(公告)号:US4297175A

    公开(公告)日:1981-10-27

    申请号:US214252

    申请日:1980-12-08

    IPC分类号: C25D5/02 C25D5/00 B21K11/02

    CPC分类号: C25D5/02

    摘要: A process for partially silver electroplating the metal surface of a flat silver part wherein part of the surface is covered prior to silvering with a plating-resistant dipping enamel. A separation surface is provided between the exposed surface of the part to be covered with the dipping enamel and the exposed surface of the lengthwise adjacent part to be silvered. The separation surface consists of a material which is more difficult to wet with the dipping enamel than the metal of the surface to be covered. Preferably, the separation surface is the peripheral surface of a spacer lamination composed of polytetrafluoroethylene.

    摘要翻译: 一种用于部分银电镀平面银部件的金属表面的方法,其中部分表面在镀银之前被覆盖有镀层的浸渍搪瓷。 在要被覆盖的部分的暴露表面与待镀银的纵向相邻部分的暴露表面之间设置分离表面。 分离表面由与待覆盖的表面的金属相比难以用浸渍搪瓷更难以润湿的材料组成。 优选地,分离表面是由聚四氟乙烯构成的间隔层叠体的外周表面。