公开(公告)号：US09029759B2

公开(公告)日：2015-05-12

申请号：US13445857

申请日：2012-04-12

申请人： Harpuneet Singh ,  Giles Humpston ,  Ellis Chau ,  Eddie Azuma ,  Peter Pietrangelo ,  Ocie Ward

发明人： Harpuneet Singh ,  Giles Humpston ,  Ellis Chau ,  Eddie Azuma ,  Peter Pietrangelo ,  Ocie Ward

IPC分类号： H01J5/02 ,  H01L31/0232 ,  H01L27/146 ,  H04N5/225

CPC分类号： H01L31/02327 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L2924/0002 ,  H04N5/2257 ,  H01L2924/00

摘要： A miniature camera module component is formed by creating replicated lens shapes on a protective cover wafer and depositing material to form multiple cavities with the replicated lens shapes respectively disposed therein. A carrier wafer is coupled to the protective cover wafer before it is diced. An intermediate wafer is coupled to the protective cover wafer, and the carrier wafer is removed. An image sensor wafer is coupled to the protective cover wafer, and the intermediate wafer is removed.

摘要翻译： 通过在保护性覆盖晶片上形成复制的透镜形状并且沉积材料以形成分别设置在其中的复制透镜形状的多个空腔而形成微型相机模块部件。 载体晶片在被切割之前被耦合到保护盖晶片。 中间晶片连接到保护盖晶片，并移除载体晶片。 将图像传感器晶片连接到保护盖晶片，并移除中间晶片。

公开(公告)号：US20130270419A1

公开(公告)日：2013-10-17

申请号：US13445857

申请日：2012-04-12

申请人： Harpuneet Singh ,  Giles Humpston ,  Ellis Chau ,  Eddie Azuma ,  Peter Pietrangelo ,  Ocie Ward

发明人： Harpuneet Singh ,  Giles Humpston ,  Ellis Chau ,  Eddie Azuma ,  Peter Pietrangelo ,  Ocie Ward

IPC分类号： H01L27/146 ,  H01L31/18

CPC分类号： H01L31/02327 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L2924/0002 ,  H04N5/2257 ,  H01L2924/00

摘要： A miniature camera module component is formed by creating replicated lens shapes on a protective cover wafer and depositing material to form multiple cavities with the replicated lens shapes respectively disposed therein. A carrier wafer is coupled to the protective cover wafer before it is diced. An intermediate wafer is coupled to the protective cover wafer, and the carrier wafer is removed. An image sensor wafer is coupled to the protective cover wafer, and the intermediate wafer is removed.

摘要翻译： 通过在保护性覆盖晶片上形成复制的透镜形状并且沉积材料以形成分别设置在其中的复制透镜形状的多个空腔而形成微型相机模块部件。 载体晶片在被切割之前被耦合到保护盖晶片。 中间晶片连接到保护盖晶片，并移除载体晶片。 将图像传感器晶片连接到保护盖晶片，并移除中间晶片。

公开(公告)号：US09001268B2

公开(公告)日：2015-04-07

申请号：US13571405

申请日：2012-08-10

申请人： Eddie Azuma ,  Chih Yen Liu ,  Emerson Yu ,  David Hsieh ,  Josh Tsai ,  Peter Pietrangelo

发明人： Eddie Azuma ,  Chih Yen Liu ,  Emerson Yu ,  David Hsieh ,  Josh Tsai ,  Peter Pietrangelo

IPC分类号： H04N5/225 ,  G03B17/00 ,  H04N5/232 ,  G03B13/00 ,  H01L31/0203

CPC分类号： H04N5/232 ,  G03B17/00 ,  H04N5/2257

摘要： A compact camera module is coupled at an image sensor end to a flexible printed circuit (FPC) and an FPC extension segment and is configured such that, upon folding the FPC onto the housing, one or more electrical contact pads disposed on the subject side of the optical train are coupled electrically with contact pads on the FPC extension segment from which MEMS actuator control signals are transmittable directly from the FPC to the MEMS lens actuator.

摘要翻译： 紧凑型相机模块在图像传感器端耦合到柔性印刷电路（FPC）和FPC延伸段，并且被配置为使得在将FPC折叠到壳体上时，设置在主体侧的一个或多个电接触垫 光学系列与FPC延伸部分上的接触焊盘电连接，MEMS致动器控制信号可以从FPC直接从FPC传输到MEMS透镜致动器。

公开(公告)号：US20140043525A1

公开(公告)日：2014-02-13

申请号：US13571405

申请日：2012-08-10

申请人： Eddie Azuma ,  Chih Yen Liu ,  Emerson Yu ,  David Hsieh ,  Josh Tsai ,  Peter Pietrangelo

发明人： Eddie Azuma ,  Chih Yen Liu ,  Emerson Yu ,  David Hsieh ,  Josh Tsai ,  Peter Pietrangelo

IPC分类号： H04N5/232

CPC分类号： H04N5/232 ,  G03B17/00 ,  H04N5/2257

摘要： A compact camera module is coupled at an image sensor end to a flexible printed circuit (FPC) and an FPC extension segment and is configured such that, upon folding the FPC onto the housing, one or more electrical contact pads disposed on the subject side of the optical train are coupled electrically with contact pads on the FPC extension segment from which MEMS actuator control signals are transmittable directly from the FPC to the MEMS lens actuator.

摘要翻译： 紧凑型相机模块在图像传感器端耦合到柔性印刷电路（FPC）和FPC延伸段，并且被配置为使得在将FPC折叠到壳体上时，设置在主体侧的一个或多个电接触垫 光学系列与FPC延伸部分上的接触焊盘电连接，MEMS致动器控制信号可以从FPC直接从FPC传输到MEMS透镜致动器。