公开(公告)号：US4622434A

公开(公告)日：1986-11-11

申请号：US672760

申请日：1984-11-19

申请人： Hart Shekerjian

发明人： Hart Shekerjian

IPC分类号： H01L23/04 ,  H01L23/045 ,  H05K5/03

CPC分类号： H01L23/04 ,  H01L23/045 ,  H01L2924/0002

摘要： Packaging of discrete semiconductor devices is improved by dimpling metal caps prior to assembly onto headers and welding.The dimpled caps provide a friction fit to the headers, whereby fewer assembled, but unwelded packages separate during handling. The dimples are more economical and more reliable than prior art crimps which perform a similar function.

摘要翻译： 在组装到集管和焊接之前，通过使金属盖凹陷来改善分立半导体器件的封装。 凹槽盖提供与集管的摩擦配合，由此在处理期间较少组装但未焊接的包装分离。 凹坑比执行类似功能的现有技术卷曲更经济和更可靠。