公开(公告)号：US20100206085A1

公开(公告)日：2010-08-19

申请号：US12706376

申请日：2010-02-16

申请人： Haruhiko Sekiya ,  Shuji Tohyama ,  Hironori Kobayashi ,  Nobuhiko Akimoto

发明人： Haruhiko Sekiya ,  Shuji Tohyama ,  Hironori Kobayashi ,  Nobuhiko Akimoto

IPC分类号： G01L9/00

CPC分类号： G01L19/142 ,  G01L19/148

摘要： In a sensor, a joint is provided with a sensor module, and the sensor module is accommodated in a housing. The housing is provided with a terminal, and a flexible circuit board electrically connects a diaphragm of the sensor module with the terminal. The joint is also provided with a cap-shaped base, and the top of the base is provided with an opening through which the diaphragm is exposed. A lateral surface of the base, which is crosswise with the top where the opening is provided, is provided with a part of the flexible circuit board, and the part is provided with an electronic component. With this arrangement, no plate-shaped circuit board for mounting the electronic component is required, thereby reducing the manufacturing cost. Moreover, since the electronic component is provided on the lateral surfaces of the base, the base and the electronic component are horizontally arranged.

摘要翻译： 在传感器中，接头设置有传感器模块，并且传感器模块容纳在壳体中。 壳体设置有端子，柔性电路板将传感器模块的隔膜与端子电连接。 接头还设置有帽状基部，并且基部的顶部设置有开口，隔膜通过该开口露出。 与设置有开口的顶部交叉的基部的侧表面设置有柔性电路板的一部分，并且该部分设置有电子部件。 通过这种布置，不需要用于安装电子部件的板状电路板，从而降低制造成本。 此外，由于电子部件设置在基座的侧面上，所以基部和电子部件水平配置。

公开(公告)号：US08286496B2

公开(公告)日：2012-10-16

申请号：US12706376

申请日：2010-02-16

申请人： Haruhiko Sekiya ,  Shuji Tohyama ,  Hironori Kobayashi ,  Nobuhiko Akimoto

发明人： Haruhiko Sekiya ,  Shuji Tohyama ,  Hironori Kobayashi ,  Nobuhiko Akimoto

IPC分类号： G01L9/00

CPC分类号： G01L19/142 ,  G01L19/148

摘要： In a sensor, a joint is provided with a sensor module, and the sensor module is accommodated in a housing. The housing is provided with a terminal, and a flexible circuit board electrically connects a diaphragm of the sensor module with the terminal. The joint is also provided with a cap-shaped base, and the top of the base is provided with an opening through which the diaphragm is exposed. A lateral surface of the base, which is crosswise with the top where the opening is provided, is provided with a part of the flexible circuit board, and the part is provided with an electronic component. With this arrangement, no plate-shaped circuit board for mounting the electronic component is required, thereby reducing the manufacturing cost. Moreover, since the electronic component is provided on the lateral surfaces of the base, the base and the electronic component are horizontally arranged.

摘要翻译： 在传感器中，接头设置有传感器模块，并且传感器模块容纳在壳体中。 壳体设置有端子，柔性电路板将传感器模块的隔膜与端子电连接。 接头还设置有帽状基部，并且基部的顶部设置有开口，隔膜通过该开口露出。 与设置有开口的顶部交叉的基部的侧表面设置有柔性电路板的一部分，并且该部分设置有电子部件。 通过这种布置，不需要用于安装电子部件的板状电路板，从而降低制造成本。 此外，由于电子部件设置在基座的侧面上，所以基部和电子部件水平配置。

公开(公告)号：US06298730B1

公开(公告)日：2001-10-09

申请号：US09208689

申请日：1998-12-10

申请人： Kouzou Yamagishi ,  Toshiaki Okumura ,  Yoji Serizawa ,  Haruhiko Sekiya ,  Takayuki Yokoyama ,  Yasutaka Ide ,  Ikuya Miyahara ,  Yasuo Watanabe ,  Shuzi Tohyama ,  Hayato Kobayashi

发明人： Kouzou Yamagishi ,  Toshiaki Okumura ,  Yoji Serizawa ,  Haruhiko Sekiya ,  Takayuki Yokoyama ,  Yasutaka Ide ,  Ikuya Miyahara ,  Yasuo Watanabe ,  Shuzi Tohyama ,  Hayato Kobayashi

IPC分类号： G01L900

CPC分类号： G01L19/148 ,  G01L19/0084 ,  G01L19/142 ,  G01L19/147

摘要： A pressure sensor (1) having a first terminal (35), the first terminal (35) including a horizontal portion (61) and a vertical portion (62) at an intermediate portion thereof and being elastically deformable. A portion of the first terminal (35) being inserted and soldered to a circuit substrate (33) has a collar portion (63) being abutted around a through-hole (51) of the circuit substrate (33). The first terminal (35) is fixed at a state being pressed to the circuit substrate (33) by the collar portion (63) and being slightly compressed between a base member (32). When the circuit substrate (33) and the base member (32) are spaced apart by circumambient heat, the first terminal (35) can follow by the compressed margin. When the first terminal (35) itself is thermally expanded, the first terminal (35) can follow by an elastic deformation of the horizontal portion (61) and the vertical portion (62). Accordingly, stress caused to the soldered portion by a thermal deformation and the like can be relaxed so that the pressure sensor (1) can be applied to a wider temperature range.

摘要翻译： 一种具有第一端子（35）的压力传感器（1），所述第一端子（35）在其中间部分包括水平部分（61）和垂直部分（62）并且是可弹性变形的。 第一端子（35）的插入和焊接到电路基板（33）的部分具有环绕电路基板（33）的通孔（51）的轴环部分（63）。 第一端子（35）被固定在被套环部分（63）按压到电路基板（33）并且在基部构件（32）之间被略微压缩的状态。 当电路基板（33）和基部构件（32）通过周向热隔开时，第一端子（35）可以跟随压缩边缘。 当第一端子（35）本身热膨胀时，第一端子（35）可以由水平部分（61）和垂直部分（62）的弹性变形引起。 因此，通过热变形等对焊接部产生的应力可以被松弛，使得压力传感器（1）可以应用于较宽的温度范围。