公开(公告)号：US11650112B1

公开(公告)日：2023-05-16

申请号：US17969944

申请日：2022-10-20

Applicant: Hebei University of Technology

Inventor： Longbang Qing ,  Ru Mu ,  Li Wang ,  Guorui Cao

IPC: G01L1/24 ,  G01N3/06 ,  G06T7/11

CPC classification number: G01L1/248 ,  G01N3/068 ,  G06T7/11 ,  G01N2203/0066 ,  G06T2207/10048

Abstract: A discontinuous deformation measurement method based on infrared and visible light cameras may include: preparing a conductive film and a random speckle pattern on a surface of the conductive film; obtaining a visible image and an infrared image under a loading stage; applying a crack boundary detection to the visible image to obtain an initial coordinate of a micro-crack, determining an range of the micro-crack based on a temperature-rising region from the infrared image and the initial coordinate; setting a position corresponding to the range of the micro-crack in the visible image as a new region of interest; obtaining full-field principal tensile strains by a DIC method, and locating an accurate boundary of the micro-crack based on gradient distribution of the full-field principal tensile strains; analyzing displacement and strain fields around the micro-crack using the DIC method.