Apparatus for controlling the temperature of a wafer located at a pre-alignment stage
    1.
    发明授权
    Apparatus for controlling the temperature of a wafer located at a pre-alignment stage 有权
    用于控制位于预对准阶段的晶片的温度的装置

    公开(公告)号:US06370793B1

    公开(公告)日:2002-04-16

    申请号:US09584551

    申请日:2000-06-01

    IPC分类号: B65G4907

    摘要: Apparatus for controlling the temperature of a wafer in a wafer pre-alignment stage has an air injection member for injecting cooling air towards a chucked wafer and an air guide for guiding a predetermined amount of the injected air towards a portion of the wafer adjacent the edge sensor to compensate for a relatively high temperature condition existing at the region of the edge sensor due to the operation thereof. The air injection member is connected with an air supplier and includes an air injection head having a bottom plate through which a plurality of injection holes extend. The air guide is a flow rate controlling plate which is disposed within the air injection head. The air introduced received by the air injection head is guided towards the region of the edge sensor by the flow rate controlling plate. By maintaining the surface temperature of a wafer uniform in the wafer pre-alignment stage, semiconductor device defects otherwise caused by the physical thermal expansion of wafers can be markedly reduced.

    摘要翻译: 用于控制晶片预对准台中的晶片的温度的装置具有用于将冷却空气朝向夹持晶片注入的空气注入构件和用于将预定量的注入空气引导到邻近边缘的晶片的一部分的空气引导件 传感器以补偿由于其操作而存在于边缘传感器的区域处的相对高的温度条件。 空气喷射构件与空气供应器连接,并且包括具有底板的空气喷射头,多个喷射孔通过该底板延伸。 空气引导件是设置在空气喷射头内的流量控制板。 由空气喷射头引入的空气被流量控制板引导到边缘传感器的区域。 通过将晶片的表面温度维持在晶片预对准阶段的均匀性,可以显着降低晶片的物理热膨胀导致的半导体器件缺陷。