公开(公告)号：US06436248B1

公开(公告)日：2002-08-20

申请号：US09434590

申请日：1999-11-05

申请人： Heinz Baur ,  Ralf Bluethner ,  Hans Buchberger ,  Klaus Goedicke ,  Michael Junghaehnel ,  Karl-Heinz Lehnert ,  Manfred Mueller ,  Hans-Herrman Schneider ,  Torsten Winkler

发明人： Heinz Baur ,  Ralf Bluethner ,  Hans Buchberger ,  Klaus Goedicke ,  Michael Junghaehnel ,  Karl-Heinz Lehnert ,  Manfred Mueller ,  Hans-Herrman Schneider ,  Torsten Winkler

IPC分类号： C23C1434

CPC分类号： G11B5/7325 ,  C23C14/165 ,  C23C14/34

摘要： A method of coating of thin film coated magnetic disks and thin film magnetic disks made thereby is described. In accordance with the invention, a barrier layer is deposited on the substrate before the underlayer film(s) to increase the corrosion resistance of metallic substrate magnetic disks and, in the case of nonmetallic substrates, to reduce the diffusion of water to the substrate and of freely moveable ions from the substrate. Preferably the barrier layer is deposited by medium frequency pulsed sputtering at a frequency of 10 to 200 kHz and a pulse length to pulse pause ratio from 5:1 to 1:10. Aluminum or chromium are the preferred materials for the barrier layer. Additional improvements may be achieved where the sputtering process gas contains a proportion of oxygen and/or nitrogen.

摘要翻译： 描述了由此制成的薄膜涂覆磁盘和薄膜磁盘的涂覆方法。 根据本发明，在下层膜之前在衬底上沉积阻挡层以提高金属基底磁盘的耐腐蚀性，并且在非金属基底的情况下，减少水向衬底的扩散， 可自由移动的离子。 优选地，阻挡层通过中频脉冲溅射以10至200kHz的频率和脉冲长度与脉冲间隔比从5:1沉积到1:10。 铝或铬是阻挡层的优选材料。 当溅射工艺气体含有一部分氧和/或氮时，可以实现另外的改进。