Low emissive powder coating
    1.
    发明申请
    Low emissive powder coating 审中-公开
    低发射粉末涂层

    公开(公告)号:US20070251420A1

    公开(公告)日:2007-11-01

    申请号:US11590553

    申请日:2007-01-22

    IPC分类号: B05D1/00

    CPC分类号: C09D5/033 C09D5/38

    摘要: A powder coating composition comprising an intimate mixture of at least one thermoplastic and/or thermosetting resin binder and optionally, at least one crosslinking agent and constituents conventional in powder coating compositions, such as, pigments, fillers and additives, comprising aluminum particles having a D50 in a range of 8 to 20 μm whereby the aluminum particles are treated with compounds selected from the group consisting of silica, (meth)acrylic polymers, polyesters and wax; the powder coating composition provides coatings with a value of thermal emissivity in a range of 0.4 to 0.55 with total solar reflectance values in a range of 60 to 70% in the infrared (IR) and/or near IR (NIR) wavelength region of 0.3 to 2.5 μm, to minimize the heat transportation through a substrate coated by the powder coating composition, e.g., from a warm building to a colder environment.

    摘要翻译: 一种粉末涂料组合物,其包含至少一种热塑性和/或热固性树脂粘合剂和任选的至少一种交联剂和在粉末涂料组合物例如颜料,填料和添加剂中常规的组分的紧密混合物,其包含具有D50 在8至20μm的范围内,由此铝颗粒用选自二氧化硅,(甲基)丙烯酸聚合物,聚酯和蜡的化合物进行处理; 粉末涂料组合物提供的涂层的热辐射率值在0.4至0.55的范围内,在红外(IR)和/或近红外(NIR)波长区域为0.3的范围内的总太阳光反射率值为60至70% 至2.5微米,以最小化通过由粉末涂料组合物涂覆的基材(例如,从温暖的建筑物到较冷的环境)的热输送。

    Procedure for electrochemical polishing of an aluminium substrate to obtain a specular surface
    5.
    发明授权
    Procedure for electrochemical polishing of an aluminium substrate to obtain a specular surface 失效
    铝基板的电化学抛光步骤,以获得镜面

    公开(公告)号:US06428682B1

    公开(公告)日:2002-08-06

    申请号:US09508242

    申请日:2000-05-23

    IPC分类号: C25F300

    CPC分类号: C25F3/20

    摘要: A process for removing or reducing the directionality or anisotropy of a surface and for making the surface specular on a substrate material consisting of aluminium or an aluminium alloy, by (a) chemically etching the substrate material, (b) subjecting the etched substrate material substrate material to electrochemical polishing by using a solution, and (c) subjecting the substrate material to additional chemical etching and electrochemical polishing directly after step (b), wherein the surface of the substrate material is not exposed to air between the etching and the electrochemical polishing.

    摘要翻译: 通过(a)化学蚀刻基板材料,(b)对蚀刻的基板材料基板进行蚀刻,去除或降低表面的方向性或各向异性并使由Al或Al合金构成的基板材料形成表面镜面的方法 通过使用溶液进行电化学抛光的材料,和(c)在步骤(b)之后直接对基底材料进行额外的化学蚀刻和电化学抛光,其中基底材料的表面在蚀刻和电化学抛光之间不暴露于空气 。