公开(公告)号：US20200026011A1

公开(公告)日：2020-01-23

申请号：US16587873

申请日：2019-09-30

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Mir Ashkan Seyedi ,  Marco Fiorentino ,  Geza Kurczveil ,  Raymond G. Raymond

IPC: G02B6/43 ,  H01S3/13 ,  G02B6/42 ,  H01S3/23 ,  H01S3/131

Abstract: A photonic integrated circuit package includes two arrays or sets of integrated comb laser modules that are bonded to a silicon interposer. Each comb laser of an array has a common or overlapping spectral range, with each laser in the array being optically coupled to a local optical bus. The effective spectral range of the lasers in each array are different, or distinct, as to each array. An optical coupler is disposed within the silicon interposer and is optically coupled to each of the local optical buses. An ASIC (application specific integrated circuit) is bonded to the silicon interposer and provides control and operation of the comb laser modules.