公开(公告)号：US10681832B1

公开(公告)日：2020-06-09

申请号：US16433857

申请日：2019-06-06

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Kevin B. Leigh ,  Everett Salinas ,  Richard Barnett ,  Michael Chan

IPC: H05K1/02 ,  H05K1/14 ,  H05K7/14 ,  H01L23/498 ,  G02B6/42 ,  H05K1/11

Abstract: A high-density universally-configurable system board architecture for use with multiple mid-board optic (MBO) type configurations is provided. The system board comprises a switch application specific integrated circuit (ASIC) assembly, a plurality of MBO interfaces comprising a plurality of via-in-pad plated over (VIPPO) vias, and a plurality of mounting holes. Each MBO interface is configured to mate with a soldered-down MBO assembly or a socket instance comprising a socketized MBO assembly. Each socketized MBO assembly comprises an interposer comprising a plurality of VIPPO vias, where the bottom contact pad of each VIPPO via is thicker than the top contact pad. Either configuration is facilitated without the need to modify the system board layout.