公开(公告)号：US10514735B2

公开(公告)日：2019-12-24

申请号：US15757973

申请日：2015-09-30

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Mohammed Fai Qureshi ,  Kevin Conn ,  Victoria Jeanine Doehring

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  G06F1/20 ,  G06F1/18 ,  G05B15/02

Abstract: According to some examples, solutions are provided for setting a cooling system of a computer system chassis by a positionable cover disposed on a computer hardware component receivable by the computer system chassis.

公开(公告)号：US20180246549A1

公开(公告)日：2018-08-30

申请号：US15757973

申请日：2015-09-30

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Mohammed Fai Qureshi ,  Kevin Conn ,  Victoria Jeanine Doehring

IPC: G06F1/20 ,  G06F1/18 ,  G05B15/02

CPC classification number: G06F1/20 ,  G05B15/02 ,  G06F1/18 ,  G06F1/181

Abstract: According to some examples, solutions are provided for setting a cooling system of a computer system chassis by a positionable cover disposed on a computer hardware component receivable by the computer system chassis.