公开(公告)号：US20210167038A1

公开(公告)日：2021-06-03

申请号：US17248988

申请日：2021-02-16

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Gregg B. Lesartre ,  Jason H. Culler ,  Martin Foltin ,  William S. Jaffe

IPC: H01L25/065 ,  H01L25/18

Abstract: According to an example, a dual in-line memory module (DIMM) may include a high density package substrate including a plurality of connectors for communicatively interconnecting the DIMM to a system.

公开(公告)号：US20200066676A1

公开(公告)日：2020-02-27

申请号：US16075962

申请日：2016-02-05

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Gregg B. Lesartre ,  Jason H. Culler ,  Martin Foltin ,  William S. Jaffe

IPC: H01L25/065 ,  H01L25/18

Abstract: According to an example, a dual in-line memory module (DIMM) may include a high density package substrate including a plurality of connectors for communicatively interconnecting the DIMM to a system.