公开(公告)号：US20220187885A1

公开(公告)日：2022-06-16

申请号：US17419744

申请日：2019-09-06

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Hung-Wen Chang ,  Chien-Tu Cheng ,  Hao-Wu Yang

IPC: G06F1/20 ,  H05K7/20

Abstract: Examples of devices and methods for controlling speed of cooling elements are discussed. The device comprises a first temperature reader to measure an ambient temperature in the vicinity of the device. The device further comprises a processor to control a speed of a cooling element of the device based on a comparison of the ambient temperature with a first threshold temperature.

公开(公告)号：US20220386506A1

公开(公告)日：2022-12-01

申请号：US17775908

申请日：2019-11-14

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Hao-Wu Yang ,  Ai-Tsung Li ,  Hung-Wen Chang ,  Chien-Tu Cheng

IPC: H05K7/20 ,  G06F1/20

Abstract: Example implementations relate to heat-sink chambers. For instance, in an example a heat-sink can include a body including a first surface and a second surface, where the body defines: a chamber that extends from the first surface through a portion of a total thickness of the body; an opening in the second surface; and a channel that extends from the chamber through a remaining portion of the total thickness of the body to the opening to couple the chamber to the opening.

公开(公告)号：US20220221917A1

公开(公告)日：2022-07-14

申请号：US17615344

申请日：2019-09-19

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Hung-Wen Chang ,  Ai-Tsung Li ,  Hao-Wu Yang ,  Chien-Tu Cheng ,  Shih-Han Chen

IPC: G06F1/20 ,  H05K7/20

Abstract: Examples of a chassis component are described herein. In an example, the chassis component can have a recess having a mesh structure and a working fluid disposed therein. A conductive cover can seal the recess with the mesh structure and the working fluid therein.