POLYESTER IMIDE RESIN BASED VARNISH FOR LOW-PERMITTIVITY COATING FILM
    1.
    发明申请
    POLYESTER IMIDE RESIN BASED VARNISH FOR LOW-PERMITTIVITY COATING FILM 审中-公开
    基于聚酯树脂的低密度涂料薄膜

    公开(公告)号:US20130153262A1

    公开(公告)日:2013-06-20

    申请号:US13818924

    申请日:2011-08-23

    IPC分类号: H01B3/30 H01B3/36

    摘要: Provided are a varnish mainly containing a polyester imide and capable of forming a low-permittivity insulating layer, as well as an insulated electronic wire achieving low permittivity by using the varnish. The varnish mainly contains a polyester imide resin obtained by reacting a carboxylic acid including a dicarboxylic acid, or an anhydride or alkyl ester thereof (carboxylic acid or derivative thereof), an alcohol, and a diamine compound with one another. In the varnish, adjustment is made such that a molar ratio (OH/COOH) of hydroxyl groups of the alcohol to carboxyl groups of the carboxylic acid or derivative thereof becomes 1.9 or less or such that a content of highly polarized imide groups per unit amount of polyester imide chain is reduced by increasing molecular weights of the raw material monomers.

    摘要翻译: 提供主要含有聚酯酰亚胺并能够形成低介电常数绝缘层的清漆,以及通过使用清漆实现低介电常数的绝缘电子线。 清漆主要含有通过使包含二羧酸或其酸酐或其烷基酯(其羧酸或其衍生物),醇和二胺化合物的羧酸彼此反应而获得的聚酯酰亚胺树脂。 在清漆中,进行调整,使得羧酸或其衍生物的醇与羧基的羟基的摩尔比(OH / COOH)为1.9以下,或每单位量的高极化酰亚胺基的含量 的聚酯酰亚胺链通过增加原料单体的分子量来降低。