公开(公告)号：US08263686B2

公开(公告)日：2012-09-11

申请号：US12600442

申请日：2008-07-01

申请人： Hideharu Takeuchi ,  Kouki Hamata ,  Masaki Kobayashi ,  Minoru Murata ,  Takahiro Koshimizu

发明人： Hideharu Takeuchi ,  Kouki Hamata ,  Masaki Kobayashi ,  Minoru Murata ,  Takahiro Koshimizu

IPC分类号： C08K9/06

CPC分类号： H01L23/296 ,  C08G59/42 ,  C08K3/34 ,  C08K9/04 ,  C08L63/00 ,  H01L23/293 ,  H01L2924/0002 ,  Y10T428/2995 ,  C08L2666/58 ,  C08L2666/28 ,  H01L2924/00

摘要： The present invention provides an optical semiconductor encapsulating composition comprising (A) an epoxy compound, (B) a carboxylic anhydride curing agent, (C) a curing accelerator, and (D) surface-coated silica particles having an average particle diameter of 5 to 50 nm in which 0.2 to 3 mmol of a silane coupling agent (D2) that contains an epoxy group-containing silane coupling agent (d1) is reacted with 1 g of silica particles (D1) to surface-coat the silica particles, the epoxy group being converted into a hydroxyl group through ring opening; and an optical semiconductor device in which an optical semiconductor is encapsulated with the composition.

摘要翻译： 本发明提供一种光学半导体封装组合物，其包含（A）环氧化合物，（B）羧酸酐固化剂，（C）固化促进剂，和（D）平均粒径为5〜 将含有含环氧基的硅烷偶联剂（d1）的0.2〜3mmol的硅烷偶联剂（D2）与1g二氧化硅粒子（D1）进行表面覆膜，50nm的环氧树脂 基团通过开环转化成羟基; 以及其中光学半导体被该组合物封装的光学半导体器件。

公开(公告)号：US20100171146A1

公开(公告)日：2010-07-08

申请号：US12600442

申请日：2008-07-01

申请人： Hideharu Takeuchi ,  Kouki Hamata ,  Masaki Kobayashi ,  Minoru Murata ,  Takahiro Koshimizu

发明人： Hideharu Takeuchi ,  Kouki Hamata ,  Masaki Kobayashi ,  Minoru Murata ,  Takahiro Koshimizu

IPC分类号： H01L33/56 ,  C08K3/34

CPC分类号： H01L23/296 ,  C08G59/42 ,  C08K3/34 ,  C08K9/04 ,  C08L63/00 ,  H01L23/293 ,  H01L2924/0002 ,  Y10T428/2995 ,  C08L2666/58 ,  C08L2666/28 ,  H01L2924/00

摘要： The present invention provides an optical semiconductor encapsulating composition comprising (A) an epoxy compound, (B) a carboxylic anhydride curing agent, (C) a curing accelerator, and (D) surface-coated silica particles having an average particle diameter of 5 to 50 nm in which 0.2 to 3 mmol of a silane coupling agent (D2) that contains an epoxy group-containing silane coupling agent (d1) is reacted with 1 g of silica particles (D1) to surface-coat the silica particles, the epoxy group being converted into a hydroxyl group through ring opening; and an optical semiconductor device in which an optical semiconductor is encapsulated with the composition.

摘要翻译： 本发明提供一种光学半导体封装组合物，其包含（A）环氧化合物，（B）羧酸酐固化剂，（C）固化促进剂，和（D）平均粒径为5〜 将含有含环氧基的硅烷偶联剂（d1）的0.2〜3mmol的硅烷偶联剂（D2）与1g二氧化硅粒子（D1）进行表面覆膜，50nm的环氧树脂 基团通过开环转化成羟基; 以及其中光学半导体被该组合物封装的光学半导体器件。