公开(公告)号：US20100265652A1

公开(公告)日：2010-10-21

申请号：US12725501

申请日：2010-03-17

申请人： Hiroaki Agata ,  Eiji Shinohara ,  Fumio Tamura ,  Mitsuo Horiuchi

发明人： Hiroaki Agata ,  Eiji Shinohara ,  Fumio Tamura ,  Mitsuo Horiuchi

IPC分类号： G06F1/16

CPC分类号： G06F1/1632

摘要： A docking device for portable computers is disclosed. The docking device includes a casing, a connector affixed to the casing, and a support member arranged on the casing. The support member is capable of being moved up and down via an elastic member disposed therebetween.

摘要翻译： 公开了便携式计算机的对接装置。 对接装置包括壳体，固定到壳体的连接器和布置在壳体上的支撑构件。 支撑构件能够经由布置在其间的弹性构件上下移动。

公开(公告)号：US08246367B2

公开(公告)日：2012-08-21

申请号：US13023419

申请日：2011-02-08

申请人： Mitsuo Horiuchi ,  Fumio Tamura ,  Hiroaki Agata

发明人： Mitsuo Horiuchi ,  Fumio Tamura ,  Hiroaki Agata

IPC分类号： H01R13/648

CPC分类号： H01R13/6485 ,  H01R2201/06 ,  Y10T29/49204

摘要： A connecting structure reduces noise effects on an electronic device when hot docking the electronic device to mitigate against malfunctions. When a first electronic device having a first EMI shield is docked with a second electronic device having a second EMI shield, an ESD contact portion, which is connected to the second EMI shield and has higher in impedance than an EMI connecting portion, comes in contact with the first EMI shield earlier than the EMI connecting portion. Electrostatic charge carried on the first EMI shield moves slowly to the second EMI shield due to the high impedance of the ESD contact portion.

摘要翻译： 当热对接电子设备以减轻故障时，连接结构减少对电子设备的噪声影响。 当具有第一EMI屏蔽的第一电子设备与具有第二EMI屏蔽的第二电子设备对接时，连接到第二EMI屏蔽并且具有比EMI连接部分更高的阻抗的ESD接触部分接触 其中第一EMI屏蔽件早于EMI连接部分。 由于ESD接触部分的高阻抗，第一EMI屏蔽上承载的静电电荷缓慢移动到第二EMI屏蔽。

公开(公告)号：US20110128663A1

公开(公告)日：2011-06-02

申请号：US13023419

申请日：2011-02-08

申请人： Mitsuo Horiuchi ,  Fumio Tamura ,  Hiroaki Agata

发明人： Mitsuo Horiuchi ,  Fumio Tamura ,  Hiroaki Agata

IPC分类号： H05F3/00

CPC分类号： H01R13/6485 ,  H01R2201/06 ,  Y10T29/49204

摘要： A connecting structure reduces noise effects on an electronic device when hot docking the electronic device to mitigate against malfunctions. When a first electronic device having a first EMI shield is docked with a second electronic device having a second EMI shield, an ESD contact portion, which is connected to the second EMI shield and has higher in impedance than an EMI connecting portion, comes in contact with the first EMI shield earlier than the EMI connecting portion. Electrostatic charge carried on the first EMI shield moves slowly to the second EMI shield due to the high impedance of the ESD contact portion.

摘要翻译： 当热对接电子设备以减轻故障时，连接结构减少对电子设备的噪声影响。 当具有第一EMI屏蔽的第一电子设备与具有第二EMI屏蔽的第二电子设备对接时，连接到第二EMI屏蔽并且具有比EMI连接部分更高的阻抗的ESD接触部分接触 其中第一EMI屏蔽件早于EMI连接部分。 由于ESD接触部分的高阻抗，第一EMI屏蔽上承载的静电电荷缓慢移动到第二EMI屏蔽。

公开(公告)号：US07905734B2

公开(公告)日：2011-03-15

申请号：US12024902

申请日：2008-02-01

申请人： Mitsuo Horiuchi ,  Fumio Tamura ,  Hiroaki Agata

发明人： Mitsuo Horiuchi ,  Fumio Tamura ,  Hiroaki Agata

IPC分类号： H01R13/53

CPC分类号： H01R13/6485 ,  H01R2201/06 ,  Y10T29/49204

摘要： A connecting structure reduces noise effects on an electronic device when hot docking the electronic device to mitigate against malfunctions. When a first electronic device having a first EMI shield is docked with a second electronic device having a second EMI shield, an ESD contact portion, which is connected to the second EMI shield and has higher in impedance than an EMI connecting portion, comes in contact with the first EMI shield earlier than the EMI connecting portion. Electrostatic charge carried on the first EMI shield moves slowly to the second EMI shield due to the high impedance of the ESD contact portion.

摘要翻译： 当热对接电子设备以减轻故障时，连接结构减少对电子设备的噪声影响。 当具有第一EMI屏蔽的第一电子设备与具有第二EMI屏蔽的第二电子设备对接时，连接到第二EMI屏蔽并且具有比EMI连接部分更高的阻抗的ESD接触部分接触 其中第一EMI屏蔽件早于EMI连接部分。 由于ESD接触部分的高阻抗，第一EMI屏蔽上承载的静电电荷缓慢移动到第二EMI屏蔽。

公开(公告)号：US20120295459A1

公开(公告)日：2012-11-22

申请号：US13564499

申请日：2012-08-01

申请人： Mitsuo Horiuchi ,  Fumio Tamura ,  Hiroaki Agata

发明人： Mitsuo Horiuchi ,  Fumio Tamura ,  Hiroaki Agata

IPC分类号： H01R13/53 ,  H01R43/00

CPC分类号： H01R13/6485 ,  H01R2201/06 ,  Y10T29/49204

摘要： For connecting devices, an electromagnetic interference (EMI) connecting portion includes a conductor connected to a first EMI shield. An electrostatic discharge (ESD) contact portion electrically connects to a second EMI shield through a high-impedance element. The ESD contact portion electrically connects the EMI connecting portion to the second EMI shield through the high-impedance element as the ESD contact portion initially contacts the EMI connecting portion during hot docking. The ESD contact portion subsequently moves in response to the initial contact to contact a low-impedance element electrically connected to the second EMI shield and connect the EMI connecting portion to the second EMI shield through the low-impedance element.

摘要翻译： 对于连接装置，电磁干扰（EMI）连接部分包括连接到第一EMI屏蔽的导体。 静电放电（ESD）接触部分通过高阻抗元件电连接到第二EMI屏蔽。 当ESD接触部分在热对接期间初始接触EMI连接部分时，ESD接触部分通过高阻抗元件将EMI连接部分电连接到第二EMI屏蔽层。 ESD接触部分随后响应于初始接触而移动以接触电连接到第二EMI屏蔽的低阻抗元件，并且通过低阻抗元件将EMI连接部分连接到第二EMI屏蔽。

公开(公告)号：US08030889B2

公开(公告)日：2011-10-04

申请号：US12419832

申请日：2009-04-07

申请人： Fumio Tamura ,  Hiroaki Agata ,  Mitsuo Horiuchi

发明人： Fumio Tamura ,  Hiroaki Agata ,  Mitsuo Horiuchi

IPC分类号： H02J7/00 ,  H02J7/02

CPC分类号： G06F1/1632 ,  G06F1/263

摘要： A docking device for receiving a portable computer is disclosed. The docking device includes a device housing and a charging connector that is provided on a side surface of the device housing and is connected to a battery connector of a battery pack in order to charge the battery pack. The charging connector is connectable to the battery connector in a state where the battery pack and the device housing are disposed on the same plane. When the charging connector and the battery connector are in a connected state and the device housing is being moved to a position within a predetermined height from the plane, the connection state between the charging connector and the battery connector is maintained. When the device housing is being moved to a position that exceeds the predetermined height from the plane, the battery connector will be separated from the charging connector due to the weight of the battery pack.

摘要翻译： 公开了一种用于接收便携式计算机的对接装置。 对接装置包括设备外壳和充电连接器，该连接器设置在设备壳体的侧表面上，并连接到电池组的电池连接器，以便为电池组充电。 在电池组和设备壳体设置在同一平面上的状态下，充电连接器可连接到电池连接器。 当充电连接器和电池连接器处于连接状态并且装置外壳正在从平面移动到预定高度的位置时，维持充电连接器和电池连接器之间的连接状态。 当装置壳体被移动到距离平面超过预定高度的位置时，由于电池组的重量，电池连接器将与充电连接器分离。

公开(公告)号：US20080188125A1

公开(公告)日：2008-08-07

申请号：US12024902

申请日：2008-02-01

申请人： Mitsuo Horiuchi ,  Fumio Tamura ,  Hiroaki Agata

发明人： Mitsuo Horiuchi ,  Fumio Tamura ,  Hiroaki Agata

IPC分类号： H01R13/648

CPC分类号： H01R13/6485 ,  H01R2201/06 ,  Y10T29/49204

摘要： A connecting structure reduces noise effects on an electronic device when hot docking the electronic device to mitigate against malfunctions. When a first electronic device having a first EMI shield is docked with a second electronic device having a second EMI shield, an ESD contact portion, which is connected to the second EMI shield and has higher in impedance than an EMI connecting portion, comes in contact with the first EMI shield earlier than the EMI connecting portion. Electrostatic charge carried on the first EMI shield moves slowly to the second EMI shield due to the high impedance of the ESD contact portion.

摘要翻译： 当热对接电子设备以减轻故障时，连接结构减少对电子设备的噪声影响。 当具有第一EMI屏蔽的第一电子设备与具有第二EMI屏蔽的第二电子设备对接时，连接到第二EMI屏蔽并且具有比EMI连接部分更高的阻抗的ESD接触部分接触 其中第一EMI屏蔽件早于EMI连接部分。 由于ESD接触部分的高阻抗，第一EMI屏蔽上承载的静电电荷缓慢移动到第二EMI屏蔽。

公开(公告)号：US08491322B2

公开(公告)日：2013-07-23

申请号：US13564499

申请日：2012-08-01

申请人： Mitsuo Horiuchi ,  Fumio Tamura ,  Hiroaki Agata

发明人： Mitsuo Horiuchi ,  Fumio Tamura ,  Hiroaki Agata

IPC分类号： H01R13/53

CPC分类号： H01R13/6485 ,  H01R2201/06 ,  Y10T29/49204

摘要： For connecting devices, an electromagnetic interference (EMI) connecting portion includes a conductor connected to a first EMI shield. An electrostatic discharge (ESD) contact portion electrically connects to a second EMI shield through a high-impedance element. The ESD contact portion electrically connects the EMI connecting portion to the second EMI shield through the high-impedance element as the ESD contact portion initially contacts the EMI connecting portion during hot docking. The ESD contact portion subsequently moves in response to the initial contact to contact a low-impedance element electrically connected to the second EMI shield and connect the EMI connecting portion to the second EMI shield through the low-impedance element.

摘要翻译： 对于连接装置，电磁干扰（EMI）连接部分包括连接到第一EMI屏蔽的导体。 静电放电（ESD）接触部分通过高阻抗元件电连接到第二EMI屏蔽。 当ESD接触部分在热对接期间初始接触EMI连接部分时，ESD接触部分通过高阻抗元件将EMI连接部分电连接到第二EMI屏蔽层。 ESD接触部分随后响应于初始接触而移动以接触电连接到第二EMI屏蔽的低阻抗元件，并且通过低阻抗元件将EMI连接部分连接到第二EMI屏蔽。

公开(公告)号：US20090284222A1

公开(公告)日：2009-11-19

申请号：US12419832

申请日：2009-04-07

申请人： Fumio Tamura ,  Hiroaki Agata ,  Mitsuo Horiuchi

发明人： Fumio Tamura ,  Hiroaki Agata ,  Mitsuo Horiuchi

IPC分类号： H02J7/00

CPC分类号： G06F1/1632 ,  G06F1/263

摘要： A docking device for receiving a portable computer is disclosed. The docking device includes a device housing and a charging connector that is provided on a side surface of the device housing and is connected to a battery connector of a battery pack in order to charge the battery pack. The charging connector is connectable to the battery connector in a state where the battery pack and the device housing are disposed on the same plane. When the charging connector and the battery connector are in a connected state and the device housing is being moved to a position within a predetermined height from the plane, the connection state between the charging connector and the battery connector is maintained. When the device housing is being moved to a position that exceeds the predetermined height from the plane, the battery connector will be separated from the charging connector due to the weight of the battery pack.

摘要翻译： 公开了一种用于接收便携式计算机的对接装置。 对接装置包括设备外壳和充电连接器，该连接器设置在设备壳体的侧表面上，并连接到电池组的电池连接器，以便为电池组充电。 在电池组和设备壳体设置在同一平面上的状态下，充电连接器可连接到电池连接器。 当充电连接器和电池连接器处于连接状态并且装置外壳正在从平面移动到预定高度的位置时，维持充电连接器和电池连接器之间的连接状态。 当装置壳体被移动到距离平面超过预定高度的位置时，由于电池组的重量，电池连接器将与充电连接器分离。

公开(公告)号：US07755884B2

公开(公告)日：2010-07-13

申请号：US12017095

申请日：2008-01-21

申请人： Mitsuo Horiuchi ,  Shigeki Mori ,  Hiroaki Agata ,  Yasushi Honda ,  Tetsuya Ohtani

发明人： Mitsuo Horiuchi ,  Shigeki Mori ,  Hiroaki Agata ,  Yasushi Honda ,  Tetsuya Ohtani

IPC分类号： G06F1/16 ,  G02F1/1333

CPC分类号： G06F1/1616 ,  G06F1/1637 ,  G06F1/1683 ,  G06F1/1698 ,  Y10S248/918 ,  Y10S248/923

摘要： An apparatus for reducing weight and thickness of portable computers is disclosed. The apparatus includes a lower housing, an upper housing and a cosmetic cover. The lower housing is configured to accommodate electronic elements therein. The upper housing, which has an opening inside, includes a periphery connected to the lower housing and a main bridge structure connected from one edge of the periphery to another edge of the periphery for providing structural support to the upper housing in the opening and for accommodating a display module therein. The cosmetic cover is configured to cover the upper housing.

摘要翻译： 公开了一种用于减轻便携式计算机的重量和厚度的装置。 该装置包括下壳体，上壳体和化妆品盖。 下壳体被配置成在其中容纳电子元件。 具有开口内部的上壳体包括连接到下壳体的外围和从外围的一个边缘连接到另一个边缘的主桥结构，用于在开口中提供结构支撑到上壳体并用于容纳 其中的显示模块。 化妆品盖构造成覆盖上壳体。