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公开(公告)号：US20070051442A1
公开(公告)日：2007-03-08
申请号：US11510854
申请日：2006-08-28
摘要： A copper alloy material for electric parts having: 1.0 to 5.0 mass % of Ni; 0.2 to 1.0 mass % of Si; 0.05 to 2.0 mass % of Sn; 0.1 to 5.0 mass % of Zn; 0.01 to 0.3 mass % of P; 0.05 to 1.0 mass % of at least one of Fe and Co; and the balance consisting of Cu and an unavoidable impurity. The ratio, (Ni+Fe+Co)/(Si+P), between the total mass of Ni, Fe and Co and the total mass of Si and P is 4 or more and 10 or less.
摘要翻译： 1.一种电气部件用铜合金材料，其具有：1.0〜5.0质量％的Ni; Si：0.2〜1.0质量％ 0.05〜2.0质量％的Sn; 0.1〜5.0质量％的Zn; 0.01〜0.3质量％的P; 0.05〜1.0质量％的Fe和Co中的至少一种; 余量由Cu和不可避免的杂质组成。 Ni，Fe和Co的总质量与Si和P的总质量之比（Ni + Fe + Co）/（Si + P）为4以上且10以下。
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公开(公告)号：US20070051441A1
公开(公告)日：2007-03-08
申请号：US11510853
申请日：2006-08-28
摘要： A copper alloy material having: 1.0 to 5.0 mass % of Ni; 0.2 to 1.0 mass % of Si; 1.0 to 5.0 mass % of Zn; 0.1 to 0.5 mass % of Sn; 0.003 to 0.3 mass % of P; and the balance consisting of Cu and an unavoidable impurity. The mass ratio between Ni and each of Si, Zn and Sn is to be Ni/Si=4 to 6, Zn/Ni=0.5 or more, and Sn/Ni=0.05 to 0.2.
摘要翻译： 具有1.0〜5.0质量％的Ni的铜合金材料; Si：0.2〜1.0质量％ 1.0〜5.0质量％的Zn; Sn：0.1〜0.5质量％ 0.003〜0.3质量％ 余量由Cu和不可避免的杂质组成。 Ni与Si，Zn，Sn的质量比为Ni / Si = 4〜6，Zn / Ni = 0.5以上，Sn / Ni = 0.05〜0.2。
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公开(公告)号：US08361255B2
公开(公告)日：2013-01-29
申请号：US12603804
申请日：2009-10-22
摘要： A copper alloy material having: 1.0 to 5.0 mass % of Ni; 0.2 to 1.0 mass % of Si; 1.0 to 5.0 mass % of Zn; 0.1 to 0.5 mass % of Sn; 0.003 to 0.3 mass % of P; and the balance consisting of Cu and an unavoidable impurity. The mass ratio between Ni and each of Si, Zn and Sn is to be Ni/Si=4 to 6, Zn/Ni=0.5 or more, and Sn/Ni=0.05 to 0.2.
摘要翻译： 具有1.0〜5.0质量％的Ni的铜合金材料; Si：0.2〜1.0质量％ 1.0〜5.0质量％的Zn; Sn：0.1〜0.5质量％ 0.003〜0.3质量％ 余量由Cu和不可避免的杂质组成。 Ni与Si，Zn，Sn的质量比为Ni / Si = 4〜6，Zn / Ni = 0.5以上，Sn / Ni = 0.05〜0.2。
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公开(公告)号：US20100037996A1
公开(公告)日：2010-02-18
申请号：US12603804
申请日：2009-10-22
IPC分类号： C22F1/08
摘要： A copper alloy material having: 1.0 to 5.0 mass % of Ni; 0.2 to 1.0 mass % of Si; 1.0 to 5.0 mass % of Zn; 0.1 to 0.5 mass % of Sn; 0.003 to 0.3 mass % of P; and the balance consisting of Cu and an unavoidable impurity. The mass ratio between Ni and each of Si, Zn and Sn is to be Ni/Si=4 to 6, Zn/Ni=0.5 or more, and Sn/Ni=0.05 to 0.2.
摘要翻译： 具有1.0〜5.0质量％的Ni的铜合金材料; Si：0.2〜1.0质量％ 1.0〜5.0质量％的Zn; Sn：0.1〜0.5质量％ 0.003〜0.3质量％ 余量由Cu和不可避免的杂质组成。 Ni与Si，Zn，Sn的质量比为Ni / Si = 4〜6，Zn / Ni = 0.5以上，Sn / Ni = 0.05〜0.2。
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公开(公告)号：US20100096117A1
公开(公告)日：2010-04-22
申请号：US12580470
申请日：2009-10-16
CPC分类号： H01L23/3733 , F28F2255/12 , F28F2275/02 , H01L21/4878 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A radiator plate includes a core having core surfaces and holes whose hole axes are directed in a direction along a normal direction of the core surface, and heat transfer plates joined to the core surfaces and filled in the holes. A multilayer radiator plate includes a first radiator plate including a first core having first core surfaces and first holes whose hole axes are directed in a direction along a normal direction of the first core surface and first heat transfer plates joined to the first core surfaces and filled in the first holes, a second radiator plate including a second core having second core surfaces and second holes whose hole axes are directed in a direction along a normal direction of the second core surface and second heat transfer plates joined to the second core surfaces and filled in the second holes, and the first radiator plate and the second radiator plate are joined to each other.
摘要翻译： 散热板包括具有芯表面的芯体和孔沿着芯表面的法线方向的孔轴线，以及连接到芯体表面并填充在孔中的传热板。 多层散热板包括第一散热板，第一散热板包括具有第一芯表面的第一芯和沿着第一芯表面的法线方向的孔轴线的第一孔和与第一芯表面接合的第一传热板， 在第一孔中，具有第二芯体的第二散热板，第二芯体具有第二芯面和孔沿着第二芯面的法线方向的孔轴线，第二传热板与第二芯面接合， 在第二孔中，第一散热板和第二散热板彼此接合。
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