公开(公告)号：US06475328B2

公开(公告)日：2002-11-05

申请号：US09455648

申请日：1999-12-07

申请人： Hirohiko Haniu ,  Toshikazu Tomioka ,  Katsumi Tomita ,  Susumu Kobayashi

发明人： Hirohiko Haniu ,  Toshikazu Tomioka ,  Katsumi Tomita ,  Susumu Kobayashi

IPC分类号： A01N2500

CPC分类号： H05K3/285 ,  A01N25/34 ,  A01N53/00 ,  C08L63/00 ,  H01L23/564 ,  H01L2924/0002 ,  H05K3/28 ,  H05K2201/0209 ,  Y10T428/31522 ,  A01N25/10 ,  A01N2300/00 ,  H01L2924/00

摘要： To present printed wiring boards and other electronic components having excellent cockroach repelling performance even after solder reflow or solder flow. A conductive layer having a mounting land is provided on a insulating layer as a substrate, a solder resist is applied to cover the conductive layer excluding the mounting land, and an electronic component material containing a cockroach repellent is applied on the solder resist. This electronic component material is a paste containing a resin curable by crosslinking, a cockroach repellent, and a filler such as silica or talc, and by crosslinking and curing the resin by chemical reaction, a dried cockroach repelling layer is exposed and formed on the surface of the printed wiring board.

公开(公告)号：US06387387B1

公开(公告)日：2002-05-14

申请号：US09015365

申请日：1998-01-29

申请人： Hirohiko Haniu ,  Toshikazu Tomioka ,  Katsumi Tomita ,  Susumu Kobayashi

发明人： Hirohiko Haniu ,  Toshikazu Tomioka ,  Katsumi Tomita ,  Susumu Kobayashi

IPC分类号： A01N2508

CPC分类号： H05K3/285 ,  A01N25/34 ,  A01N53/00 ,  C08L63/00 ,  H01L23/564 ,  H01L2924/0002 ,  H05K3/28 ,  H05K2201/0209 ,  Y10T428/31522 ,  A01N25/10 ,  A01N2300/00 ,  H01L2924/00

摘要： To present printed wiring boards and other electronic components having excellent cockroach repelling performance even after solder reflow or solder flow. A conductive layer having a mounting land is provided on a insulating layer as a substrate, a solder resist is applied to cover the conductive layer excluding the mounting land, and an electronic component material containing a cockroach repellent is applied on the solder resist. This electronic component material is a paste containing a resin curable by crosslinking, a cockroach repellent, and a filler such as silica or talc, and by crosslinking and curing the resin by chemical reaction, a dried cockroach repelling layer is exposed and formed on the surface of the printed wiring board.

摘要翻译： 即使在焊料回流或焊料流动之后，也提供具有优异的蟑螂排斥性能的印刷线路板和其他电子部件。在作为基板的绝缘层上设置具有安装台面的导电层，涂覆阻焊剂以覆盖除了 在阻焊剂上涂布安装台面和含有蟑螂驱除剂的电子部件材料。 该电子部件材料是含有通过交联固化的树脂，蟑螂驱除剂和填充剂如二氧化硅或滑石的糊料，并且通过化学反应使树脂交联和固化，将干燥的蟑螂驱除层暴露并形成在表面上 的印刷线路板。