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    WIRING SUBSTRATE
    1.
    发明公开
    WIRING SUBSTRATE 审中-公开

    公开(公告)号：US20240365468A1

    公开(公告)日：2024-10-31

    申请号：US18643279

    申请日：2024-04-23

    申请人： IBIDEN CO., LTD.

    发明人： Masashi KUWABARA ,  Susumu KAGOHASHI ,  Jun SAKAI ,  Kyohei YOSHIKAWA

    IPC分类号： H05K1/11 ,  H05K1/03

    CPC分类号： H05K1/115 ,  H05K1/0306 ,  H05K1/113 ,  H05K2201/0209 ,  H05K2201/0242 ,  H05K2201/0266 ,  H05K2201/09536 ,  H05K2201/09827

    摘要： A wiring substrate includes a first build-up part including an insulating layer and a conductor layer, and a second build-up part laminated on the first build-up part and including an insulating layer and a conductor layer. The minimum width and minimum inter-wiring distance of wirings in the first build-up part are smaller than the minimum width and minimum inter-wiring distance of wirings in the second build-up part. The insulating layer in the first build-up part includes resin and inorganic particles including first inorganic particles partially embedded in the resin and second inorganic particles completely embedded in the resin such that the first inorganic particles have first portions protruding from the resin and second portions embedded in the resin, respectively. The insulating layer of the first build-up part has a surface covered by the conductor layer and including a surface of the resin and exposed surfaces of the first portions.

    PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME
    2.
    发明公开
    PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME 审中-公开

    公开(公告)号：US20240357741A1

    公开(公告)日：2024-10-24

    申请号：US18640555

    申请日：2024-04-19

    申请人： Samsung Electronics Co., Ltd.

    发明人： Yeonkyung CHUNG ,  Jinyong PARK ,  Chulwoo PARK ,  Yongjae SONG ,  Sangwon HA

    IPC分类号： H05K1/03

    CPC分类号： H05K1/036 ,  H05K2201/0191 ,  H05K2201/0209

    摘要： An electronic device according to an embodiment of the disclosure may comprise: a housing and a printed circuit board disposed in the housing and comprising an alternately stacked plurality of insulation layers and plurality of conductive layers. The plurality of insulation layers may include at least one first insulation layer and at least one second insulation layer. The at least one first insulation layer may include a first insulator including a resin having a Tg value of 200 degrees or more and a filler having a content of 50% to 70%. The at least one second insulation layer may include a second insulator including a glass fiber.

    WIRING SUBSTRATE
    3.
    发明公开
    WIRING SUBSTRATE 审中-公开

    公开(公告)号：US20240306296A1

    公开(公告)日：2024-09-12

    申请号：US18599671

    申请日：2024-03-08

    申请人： IBIDEN CO., LTD.

    发明人： Toshiki FURUTANI ,  Masashi KUWABARA ,  Jun SAKAI ,  Takuya INISHI

    IPC分类号： H05K1/11 ,  H05K1/03 ,  H05K3/16

    CPC分类号： H05K1/115 ,  H05K1/0306 ,  H05K3/16 ,  H05K2201/0209 ,  H05K2201/0245 ,  H05K2201/0323 ,  H05K2201/09536 ,  H05K2203/0361

    摘要： A wiring substrate includes a core substrate including a glass substrate and a through-hole conductor formed in the glass substrate, a resin insulating layer formed on the core substrate and including resin and inorganic particles, a conductor layer formed on the insulating layer and including a seed layer and an electrolytic plating layer, and a via conductor formed in the insulating layer such that the via conductor is electrically connected to the through-hole conductor formed in the glass substrate and includes the seed layer and electrolytic plating layer extending from the conductor layer. The conductor layer and the via conductor are formed such that the seed layer is formed by sputtering, and the resin insulating layer has an opening in which the via conductor is formed such that the inorganic particles include first particles forming an inner wall surface in the opening and second particles embedded in the insulating layer.

    PRINTED WIRING BOARD
    4.
    发明公开
    PRINTED WIRING BOARD 审中-公开

    公开(公告)号：US20240292536A1

    公开(公告)日：2024-08-29

    申请号：US18585113

    申请日：2024-02-23

    申请人： IBIDEN CO., LTD.

    发明人： Susumu KAGOHASHI ,  Kyohei YOSHIKAWA ,  Takuya INISHI ,  Jun SAKAI

    IPC分类号： H05K1/11 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/42

    CPC分类号： H05K1/116 ,  H05K1/09 ,  H05K3/0035 ,  H05K3/0041 ,  H05K3/423 ,  H05K1/0373 ,  H05K2201/0209

    摘要： A printed wiring board includes a first conductor layer, a resin insulating layer including resin and inorganic particles, a second conductor layer including a seed layer and an electrolytic plating layer on the seed layer, and a via conductor connecting the first conductor layer and second conductor layer and including the seed layer and electrolytic plating layer extending from the second conductor layer. The second conductor layer and via conductor are formed such that the seed layer includes an alloy including copper, aluminum and a metal including one or more metals selected from nickel, zinc, gallium, silicon and magnesium, and the resin insulating layer is formed such that the inorganic particles include first inorganic particles forming an inner wall surface in the opening and second inorganic particles embedded in the resin insulating layer and that shapes of the first inorganic particles are different from shapes of the second inorganic particles.

    PRINTED WIRING BOARD
    7.
    发明公开
    PRINTED WIRING BOARD 审中-公开

    公开(公告)号：US20240107684A1

    公开(公告)日：2024-03-28

    申请号：US18475276

    申请日：2023-09-27

    申请人： IBIDEN CO., LTD.

    发明人： Jun SAKAI ,  Takuya INISHI ,  Susumu KAGOHASHI

    IPC分类号： H05K3/46 ,  H05K1/11 ,  H05K3/16

    CPC分类号： H05K3/4608 ,  H05K1/115 ,  H05K3/16 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/095

    摘要： A printed wiring board includes a first conductor layer, a resin insulating layer having an opening, a second conductor layer including a seed layer and an electrolytic plating layer formed on the seed layer, and a via conductor including the seed and electrolytic plating layers and connecting the first and second conductor layers. The seed layer has a first portion on the surface of the insulating layer, a second portion on an inner wall surface in the opening of the insulating layer, and a third portion on a portion of the first conductor layer exposed by the opening of the insulating layer such that the first portion is thicker than the second and third portions, and the insulating layer includes resin and inorganic particles including first particles forming the inner wall surface and second particles embedded in the insulating layer and having shapes different from shapes of the first particles.

    PRINTED WIRING BOARD
    8.
    发明公开
    PRINTED WIRING BOARD 审中-公开

    公开(公告)号：US20240098892A1

    公开(公告)日：2024-03-21

    申请号：US18307886

    申请日：2023-04-27

    申请人： IBIDEN CO., LTD.

    发明人： Susumu KAGOHASHI ,  Jun SAKAI ,  Kyohei YOSHIKAWA

    IPC分类号： H05K1/03 ,  H05K1/02 ,  H05K1/11

    CPC分类号： H05K1/0373 ,  H05K1/0298 ,  H05K1/115 ,  H05K2201/0209

    摘要： A printed wiring board includes a first conductor layer, a resin insulating layer laminated on the first conductor layer and including resin material and inorganic particles, a second conductor layer formed on a first surface of the insulating layer such that the first conductor layer is facing a second surface of the insulating layer, and a via conductor formed in an opening extending through the insulating layer and connecting the first and second conductor layers. The insulating layer is formed such that the inorganic particles include first inorganic particles partially embedded in the resin and second inorganic particles completely embedded in the resin, the first inorganic particles have first portions protruding from the resin and second portions embedded in the resin respectively, and the first surface of the resin insulating layer includes a surface of the resin and surfaces of the first portions exposed from the surface of the resin.