公开(公告)号：US06989879B1

公开(公告)日：2006-01-24

申请号：US09530122

申请日：1999-08-11

申请人： Hiroki Nakahara ,  Hideki Uehara ,  Takashi Miyazaki ,  Takeshi Hagiwara

发明人： Hiroki Nakahara ,  Hideki Uehara ,  Takashi Miyazaki ,  Takeshi Hagiwara

IPC分类号： G02F1/1337 ,  G02F1/1339

CPC分类号： G02F1/1337 ,  G02F1/1339

摘要： In a liquid crystal panel 1 provided with first and second substrates 1 and 3 bonded by a sealant 3, alignment layers 13 and 23 for covering electrodes 6A and 7A, respectively, are formed up to the regions overlapping the regions for forming up to 3. Accordingly, since there is no space between the alignment 13 or 23 and the sealant 3, a low twist domain does not occur in a liquid crystal 40. Therefore, the vicinity of the inner periphery of the sealant can also be effectively used as the region for displaying images.

摘要翻译： 在设置有由密封剂3接合的第一和第二基板1和3的液晶面板1中，分别形成用于覆盖电极6A和7A的取向层13和23，直到形成至多 3。 因此，由于在对准13或23与密封剂3之间没有空间，所以在液晶40中不会发生低扭曲域。 因此，密封剂的内周附近也可以有效地用作显示图像的区域。

公开(公告)号：US20050248711A1

公开(公告)日：2005-11-10

申请号：US11153124

申请日：2005-06-15

申请人： Takashi Miyazaki ,  Hiroki Nakahara

发明人： Takashi Miyazaki ,  Hiroki Nakahara

IPC分类号： G02F1/1333 ,  G02F1/1339 ,  G02F1/1345

CPC分类号： G02F1/1339 ,  G02F2001/133354 ,  G02F2001/13456

摘要： The present invention provides a manufacturing method or a structure capable of reducing occurrence of sealing defects and breaking defects by resolving defects in form of a joined area between a sealing material and an anisotropic conductive material. A sealing material (2) is formed in such a manner as to superimpose ends (2b) on alignment marks (15) formed on the surface of a first substrate (6a), an anisotropic conductive material is formed in such a manner as to superimpose ends 3b on alignment marks (16) formed on the surface of a second substrate (6b), and the sealing material 2 and the anisotropic conductive material (3) are joined by bonding the first substrate (6a) and the second substrate (6b) to form one-piece sealing section (4).

摘要翻译： 本发明提供一种能够通过解决密封材料和各向异性导电材料之间的接合区域形式的缺陷来减少密封缺陷和断裂缺陷的发生的制造方法或结构。 密封材料（2）以将端部（b）叠置在形成在第一基板（6a）的表面上的对准标记（15）上的方式形成，各向异性导电材料形成为 将端部3b叠置在形成在第二基板（6b）的表面上的对准标记（16）上，并且密封材料2和各向异性导电材料（3）通过接合第一基板（6a）和 第二基板（6b）以形成一体式密封部分（4）。

公开(公告)号：US06930745B1

公开(公告)日：2005-08-16

申请号：US09762548

申请日：2000-06-09

申请人： Takashi Miyazaki ,  Hiroki Nakahara

发明人： Takashi Miyazaki ,  Hiroki Nakahara

IPC分类号： G02F1/1333 ,  G02F1/1339 ,  G02F1/1345

CPC分类号： G02F1/1339 ,  G02F2001/133354 ,  G02F2001/13456

摘要： The present invention provides a manufacturing method or a structure capable of reducing occurrence of sealing defects and breaking defects by resolving defects in form of a joined area between a sealing material and an anisotropic conductive material. A sealing material (2) is formed in such a manner as to superimpose ends (2b) on alignment marks (15) formed on the surface of a first substrate (6a), an anisotropic conductive material is formed in such a manner as to superimpose ends 3b on alignment marks (16) formed on the surface of a second substrate (6b), and the sealing material 2 and the anisotropic conductive material (3) are joined by bonding the first substrate (6a) and the second substrate (6b) to form one-piece sealing section (4).

摘要翻译： 本发明提供一种能够通过解决密封材料和各向异性导电材料之间的接合区域形式的缺陷来减少密封缺陷和断裂缺陷的发生的制造方法或结构。 密封材料（2）以将端部（b）叠置在形成在第一基板（6a）的表面上的对准标记（15）上的方式形成，各向异性导电材料形成为 将端部3b叠置在形成在第二基板（6b）的表面上的对准标记（16）上，并且密封材料2和各向异性导电材料（3）通过接合第一基板（6a）和 第二基板（6b）以形成一体式密封部分（4）。

公开(公告)号：US07190430B2

公开(公告)日：2007-03-13

申请号：US11153124

申请日：2005-06-15

申请人： Takashi Miyazaki ,  Hiroki Nakahara

发明人： Takashi Miyazaki ,  Hiroki Nakahara

IPC分类号： G02F1/1339 ,  G02F1/13 ,  G02F1/1345

CPC分类号： G02F1/1339 ,  G02F2001/133354 ,  G02F2001/13456

摘要： The present invention provides a manufacturing method or a structure capable of reducing occurrence of sealing defects and breaking defects by resolving defects in form of a joined area between a sealing material and an anisotropic conductive material. A sealing material (2) is formed in such a manner as to superimpose ends (2b) on alignment marks (15) formed on the surface of a first substrate (6a), an anisotropic conductive material is formed in such a manner as to superimpose ends 3b on alignment marks (16) formed on the surface of a second substrate (6b), and the sealing material 2 and the anisotropic conductive material (3) are joined by bonding the first substrate (6a) and the second substrate (6b) to form one-piece sealing section (4).

摘要翻译： 本发明提供一种能够通过解决密封材料和各向异性导电材料之间的接合区域形式的缺陷来减少密封缺陷和断裂缺陷的发生的制造方法或结构。 密封材料（2）以将端部（b）叠置在形成在第一基板（6a）的表面上的对准标记（15）上的方式形成，各向异性导电材料形成为 将端部3b叠置在形成在第二基板（6b）的表面上的对准标记（16）上，并且密封材料2和各向异性导电材料（3）通过接合第一基板（6a）和 第二基板（6b）以形成一体式密封部分（4）。

公开(公告)号：US06473147B1

公开(公告)日：2002-10-29

申请号：US09424433

申请日：1999-11-23

申请人： Hiroki Nakahara ,  Hideaki Okumura ,  Takeshi Nakamura

发明人： Hiroki Nakahara ,  Hideaki Okumura ,  Takeshi Nakamura

IPC分类号： G02F11339

CPC分类号： G02F1/1339 ,  G02F1/1345

摘要： Regarding a liquid crystal device having a structure in which electrodes formed on a pair of substrates are subjected to conductive connection using a conductive member, the outer dimensions can be reduced despite the use of the conductive member, and a complicated pattern design including cross wiring and the like can be employed for the electrode patterns formed on the pair of substrates. A liquid crystal device is formed by joining a first substrate 2a comprising first electrodes 7a and external joining elements 8 and a second substrate 2b comprising second electrodes 7b by an annular sealing member 3. The sealing member 3 includes a conductive section 3b having the function of conductive connection and a non-conductive section 3a having no function of conductive connection, and the second electrodes 7b on the second substrate 2b are individually subjected to conductive connection to the terminals 8 on the first substrate 2a via the conductive section 3b of the sealing member 3. The non-conductive section 3a does not have the function of conductive connection, so that the first electrodes 7a and the second electrodes 7b can be subjected to cross wiring at that section.

摘要翻译： 关于具有这样的结构的液晶装置，其中使用导电部件对形成在一对基板上的电极进行导电连接，尽管使用导电部件也可以减小外部尺寸，并且包括交叉布线和 可以采用在一对基板上形成的电极图案。 通过将包括第一电极7a和外部接合元件8的第一基板2a和包括第二电极7b的第二基板2b通过环形密封构件3接合而形成液晶装置。密封构件3包括导电部分3b， 导电连接和不具有导电连接功能的非导电部分3a，并且第二基板2b上的第二电极7b经由密封构件的导电部分3b分别经受与第一基板2a上的端子8的导电连接 不导电部分3a不具有导电连接的功能，使得第一电极7a和第二电极7b可以在该部分进行交叉布线。

公开(公告)号：US06950170B2

公开(公告)日：2005-09-27

申请号：US10413444

申请日：2003-04-14

申请人： Hiroki Nakahara ,  Takatomo Toda ,  Kotaro Ueno

发明人： Hiroki Nakahara ,  Takatomo Toda ,  Kotaro Ueno

IPC分类号： G02F1/1333

CPC分类号： G02F1/1333 ,  G02F1/133351 ,  G02F2001/133302 ,  G02F2201/503

摘要： An electro-optical panel having improved cracking resistance includes a substrate having scratches and cracks formed during a production process removed by etching.

摘要翻译： 具有改进的抗开裂性的电光面板包括在通过蚀刻去除生产过程中形成的划痕和裂纹的基板。

公开(公告)号：US06893688B2

公开(公告)日：2005-05-17

申请号：US09946808

申请日：2001-09-05

申请人： Hiroki Nakahara

发明人： Hiroki Nakahara

IPC分类号： G02F1/13 ,  G02F1/1333 ,  G02F1/1337 ,  G09F9/00 ,  G09F9/30 ,  B05D3/06 ,  B01J19/10 ,  B05D3/12

CPC分类号： G02F1/133788

摘要： A method for manufacturing an electro-optical device deposited with an insulating film or alignment layer on the surface of a substrate, the method is characterized by including the step of irradiating ultraviolet radiation onto the surface of the substrate (an ultraviolet radiation irradiating step) and the step of depositing the insulating film or alignment layer on the surface of the substrate irradiated with the ultraviolet radiation (an insulating material coating step or alignment layer coating step).

摘要翻译： 一种用于制造在基板表面上沉积有绝缘膜或取向层的电光装置的方法，其特征在于包括将紫外线辐射照射到基板表面上的步骤（紫外线照射步骤）和 将绝缘膜或取向层沉积在用紫外线照射的基板的表面上的步骤（绝缘材料涂布步骤或取向层涂布步骤）。

公开(公告)号：US06724448B2

公开(公告)日：2004-04-20

申请号：US09742882

申请日：2000-12-20

申请人： Hiroki Nakahara

发明人： Hiroki Nakahara

IPC分类号： G02F11337

CPC分类号： G02F1/1345 ,  G02F1/133711

摘要： When transparent substrates 110 and 120 are compression-bonded via a sealing member 130, conductive particles 132 formed to be slightly larger break through relatively soft alignment layers 113 and 123 to become in contact with both inner end portions 111c and outer end portions 121c, and in this state, the sealing member 130 is cured.

摘要翻译： 当通过密封构件130将透明基板110和120压接时，形成为稍大的导电颗粒132穿过较软的对准层113和123而与内端部分111c和外端部分121c接触，并且 在该状态下，密封构件130固化。