公开(公告)号：US20210389642A1

公开(公告)日：2021-12-16

申请号：US17331534

申请日：2021-05-26

Applicant: Hirose Electric Co., Ltd.

Inventor： Kihong KIM ,  Jeremy BUAN ,  Tsutomu MATSUO ,  Tadashi OHSHIDA

IPC: G02F1/295 ,  G02F1/335 ,  G02B6/42

Abstract: Example implementations described herein are directed to an interface configured to redirect light between a connector connected to a printed optical board (POB) via an optical waveguide, and a photonic integrated circuit (PIC), the interface involving two-dimensionally distributed waveplates (TDWs) having multiple layers of p-doped and n-doped silicon, the TDWs configured to be driven to change a dielectric constant at a two dimensional location on the TDWs such that the received light is redirected at the two dimensional location.

公开(公告)号：US20210325608A1

公开(公告)日：2021-10-21

申请号：US17216207

申请日：2021-03-29

Applicant: Hirose Electric Co., Ltd.

Inventor： Kihong KIM ,  Jeremy BUAN ,  Tadashi OHSHIDA ,  Tsutomu MATSUO ,  Shuji SUZUKI ,  Nobuhiro TAMAI ,  Hiromichi MURAOKA

IPC: G02B6/122

Abstract: Example implementations described herein are directed to a system involving one or more photonic integrated circuits having multi-mode waveguides and connected to a printed optical board through the use of multi-mode waveguide connectors described herein. The printed optical board can include an embedded multi-mode waveguide bus to facilitate optical signal to and from the photonic integrated circuits. The system can also include a chiplet such as a photonic integrated circuit with a single mode waveguide configured to connect to an optical fiber cable.

公开(公告)号：US20230094831A1

公开(公告)日：2023-03-30

申请号：US17943219

申请日：2022-09-13

Applicant: Hirose Electric Co. Ltd.

Inventor： Kihong KIM ,  Jeremy Buan ,  Yutaka Iwasaki

IPC: G02B6/43 ,  G02B6/42

Abstract: Example implementations described herein involve a media adaptor configured to provide electrical/optical and optical/electrical conversion for a multi-mode waveguide (MMWG) interconnect, the media adaptor involving one or more ball grid arrays; and a tail-cut fiber array block (tcFAB) connected to a first array of photodiodes and a second array of laser diodes from direct optical wire (DOW) bonding.