摘要:
There is provided an electronic component mounting apparatus including: a component holder which holds an electronic component; a pressing unit which applies pressure to the held electronic component through the component holder; and an ultrasonic transducer which applies ultrasonic vibration to the held electronic component through the component holder. The component holder includes a horn at one end of which is mounted the ultrasonic transducer and a holding tool which is fixed to the other end of the horn by using bolts and holds the electronic component. The horn has a surface A1 and a surface A2 at the other end and the holding tool has a surface B1 in intimate contact with the surface A1 and a surface B2 in intimate contact with the surface A2.
摘要:
A bonding tool, including: a component mounting unit including a horn that has a heater insertion hole, in which a heater is inserted with a predetermined clearance, and transmits ultrasonic vibration, an ultrasonic transducer that is fixed on the horn and produces the ultrasonic vibration, and an electronic component holder that is fixed on the horn, holds an electronic component and is heated by the heater; a leg that supports the horn on both sides of the horn at nodal points of the ultrasonic vibration on the horn; a supporter that holds the leg; and a heater holder that holds the heater on both sides of the horn, wherein the leg and the heater holder are formed integrally with each other.