LOAD PORT AND ADAPTOR
    1.
    发明申请
    LOAD PORT AND ADAPTOR 审中-公开
    负载端口和适配器

    公开(公告)号:US20110303125A1

    公开(公告)日:2011-12-15

    申请号:US11667339

    申请日:2004-11-09

    IPC分类号: A47B37/00

    CPC分类号: H01L21/67775

    摘要: A load port, which can selectively place wafer carriers differing in size on a table and can map wafers differing in size stored in the wafer carriers, and an adaptor, which can indirectly attach a wafer carrier on the table, are provided. A load port (100) includes a movable table (110) movably provided on the table (101), a module (161) for determining a carrier, and a module (162) for mapping a wafer. A wafer carrier (200) storing wafers (200A) is indirectly seated on the movable table via an adaptor (10), or a wafer carrier (300) storing wafers (300A) is directly seated on the movable table. The module (161) detects which of the wafer carriers is seated on the movable table and outputs a detection signal in response to the wafer carriers. The module (162) conducts mapping for the wafers, receiving the detection signal sent from the module (161).

    摘要翻译: 一种负载端口,其可以选择性地将尺寸不同的晶片载体放置在台上,并且可以映射存储在晶片载体中的尺寸不同的晶片载体,以及可以间接地将晶片载体附接到工作台上的适配器。 负载端口(100)包括可移动地设置在工作台(101)上的可移动台(110),用于确定载体的模块(161)和用于映射晶片的模块(162)。 存储晶片(200A)的晶片载体(200)经由适配器(10)间接地安置在可移动台上,或者存储晶片(300A)的晶片载体(300)直接安置在可移动台上。 模块(161)检测哪个晶片载体位于可移动台上,并响应于晶片载体输出检测信号。 模块(162)对晶片进行映射,接收从模块(161)发送的检测信号。

    Load port
    2.
    发明申请
    Load port 审中-公开
    加载端口

    公开(公告)号:US20090169342A1

    公开(公告)日:2009-07-02

    申请号:US11630123

    申请日:2004-06-21

    IPC分类号: H01L21/677

    CPC分类号: H01L21/67775 H01L21/67772

    摘要: A load port (100) comprises: a mounting base (101) for mounting a wafer carrier (10); a nozzle unit (110) having nozzle outlets (111) for generating an outflow/inflow of a purge gas in a direction approximately parallel to spaces (A) between wafers (1) stored within the wafer carrier (10) so as to replace the atmosphere of the wafer carrier (10); a driving unit including a nozzle driving motor (166) etc., for extending the nozzle unit (110) toward a door opening portion (202) of the load port (100) formed near a wall face (201) of a clean room where a wafer processing apparatus has been installed; an airtight space forming unit (120) which can be connected to a container opening (12) in an airtight manner, thereby forming an airtight space (B) that communicates with the interior space of the wafer carrier (10); a control unit (160) for controlling the switching of the flow of the purge gas generated by the nozzle unit (110) according to the oxygen concentration that indicates the purge degree of the atmosphere of the wafer carrier (10); etc.

    摘要翻译: 负载端口(100)包括:用于安装晶片载体(10)的安装基座(101); 具有喷嘴出口(111)的喷嘴单元(110),用于在与晶片载体(10)中存储的晶片(1)之间的空间(A)大致平行的方向上产生吹扫气体的流出/流入,以便代替 晶片载体(10)的气氛; 驱动单元,其包括喷嘴驱动马达(166)等,用于将喷嘴单元(110)朝向在洁净室的壁面(201)附近形成的负载口(100)的门开口部(202)延伸, 已经安装了晶片处理装置; 气密空间形成单元(120),其可以气密地连接到容器开口(12),从而形成与晶片载体(10)的内部空间连通的气密空间(B); 根据表示晶片载体(10)的气氛的吹扫度的氧浓度,控制由喷嘴单元(110)产生的吹扫气体的流量切换的控制单元(160)。 等等

    Atmosphere Purge-Port Connecting Device for Wafer Storage Container
    4.
    发明申请
    Atmosphere Purge-Port Connecting Device for Wafer Storage Container 审中-公开
    用于晶圆储存容器的大气清洗口连接装置

    公开(公告)号:US20080260498A1

    公开(公告)日:2008-10-23

    申请号:US11547621

    申请日:2004-04-07

    IPC分类号: H01L23/02

    摘要: A connecting device is provided to a wafer carrier for storing a wafer and connected to a purge port having a gas inlet into which a gas for purging an atmosphere in the wafer carrier flows. The connecting device includes, a base; a communication port formed in the base; and a close-contact mechanism that includes, a sealing ring, a groove, and a pressure-reducing passage that communicates with the groove. The pressure in a space defined by the groove and a peripheral edge of the gas inlet is reduced at a position where the base makes contact with the purge port, bringing the gas inlet into close contact with the communication port.

    摘要翻译: 将连接装置设置在晶片载体上,用于存储晶片并连接到具有气体入口的吹扫口,用于吹扫晶片载体中的气氛的气体流入该气体入口。 连接装置包括:基座; 在基座上形成的通信端口; 以及紧密接触机构,其包括与槽连通的密封环,槽和减压通路。 由凹槽和气体入口的周缘限定的空间中的压力在基部与吹扫口接触的位置处减小,使得气体入口与连通口紧密接触。