摘要:
The present invention has an object to provide curatives for epoxy resins and curing accelerators for epoxy resins, which both have improved subliming and decomposing properties and which, when mixed with an epoxy resin, enable the mixture to be greatly improved in thermal stability that is extremely important for the control of a curing reaction and to have a prolonged pot life (stability as a one-pack mixture comprising the epoxy resin, curative, etc.) and improved curability at low temperatures. The curative is characterized by being a clathrate comprising a tetrakisphenol compound represented by a general formula (I), wherein X represents (CH2)n, wherein n is 0, 1, 2 or 3, and R1 to R8 each represents hydrogen, a lower alkyl, optionally-substituted phenyl, halogeno or a lower alkoxy, and the curing accelerator is characterized by being a clathrate comprising a tetrakisphenol compound represented by the general formula (I) shown above and a compound accelerating the curing of a compound which reacts with the epoxy group of an epoxy resin to cure the resin.
摘要翻译:本发明的目的是提供用于环氧树脂的固化剂和用于环氧树脂的固化促进剂,它们都具有改进的升华和分解性能,并且当与环氧树脂混合时,能够使混合物的热稳定性大大提高 对于固化反应的控制是重要的,并且具有延长的适用期(作为包含环氧树脂,固化剂等的单组分混合物的稳定性)和在低温下的改进的固化性。 固化剂的特征在于包含由通式(I)表示的四苯酚化合物的包合物,其中X表示(CH 2)2,其中n为0,1,2或3,R R 8和R 8各自表示氢,低级烷基,任选取代的苯基,卤代或低级烷氧基,固化促进剂的特征在于包含四苯酚的包合物 由上述通式(I)表示的化合物和加速与环氧树脂的环氧基反应的化合物固化以使树脂固化的化合物。
摘要:
The present invention has an object to provide curatives for epoxy resins and curing accelerators for epoxy resins, which both have improved subliming and decomposing properties and which, when mixed with an epoxy resin, enable the mixture to be greatly improved in thermal stability that is extremely important for the control of a curing reaction and to have a prolonged pot life (stability as a one-pack mixture comprising the epoxy resin, curative, etc.) and improved curability at low temperatures. The curative is characterized by being a clathrate comprising a tetrakisphenol compound represented by a general formula (I), wherein X represents (CH2)n, wherein n is 0, 1, 2 or 3, and R1 to R8 each represents hydrogen, a lower alkyl, optionally-substituted phenyl, halogeno or a lower alkoxy, and the curing accelerator is characterized by being a clathrate comprising a tetrakisphenol compound represented by the general formula (I) shown above and a compound accelerating the curing of a compound which reacts with the epoxy group of an epoxy resin to cure the resin.