公开(公告)号：US4540773A

公开(公告)日：1985-09-10

申请号：US649452

申请日：1984-09-11

申请人： Hiroyasu Komazawa ,  Hiroshi Hotta ,  Hiroshi Nakatsuji ,  Kiyoshi Yoko ,  Seiichi Higashiyama ,  Tuneyasu Nakashima ,  Noboru Gotoh

发明人： Hiroyasu Komazawa ,  Hiroshi Hotta ,  Hiroshi Nakatsuji ,  Kiyoshi Yoko ,  Seiichi Higashiyama ,  Tuneyasu Nakashima ,  Noboru Gotoh

IPC分类号： C08G2/36 ,  C08G2/28

CPC分类号： C08G2/36

摘要： A crude polyacetal polymer obtained by polymerization or copolymerization and having as a principal component thereof connected oxymethylene radicals in a main chain is treated in a non-soluble liquid medium at temperatures higher than 80.degree. C. but lower than the melting point of the polymer and at heterogeneous equilibrium, moving the crude polymer and the non-soluble medium in opposite directions relative to each other.

摘要翻译： 通过聚合或共聚获得并且在主链中连接氧亚甲基的主要成分的粗聚缩醛聚合物在非可溶性液体介质中在高于80℃但低于聚合物的熔点的条件下进行处理， 在非均衡平衡下，将粗聚合物和不溶性介质相对于彼此相反的方向移动。

公开(公告)号：US5113622A

公开(公告)日：1992-05-19

申请号：US747494

申请日：1991-08-19

申请人： Masanori Nishiguchi ,  Noboru Gotoh

发明人： Masanori Nishiguchi ,  Noboru Gotoh

IPC分类号： B24B7/22 ,  B24B37/04 ,  B24B55/02

CPC分类号： B24B7/228 ,  B24B37/04 ,  B24B55/02

摘要： An apparatus is provided for grinding a semiconductor wafer, which includes a table having a work stage on which a semiconductor wafer to be ground is placed, at least the work stage being rotatable about an axis, and a grinding wheel which is movable in a direction perpendicular to or parallel to the work stage while being rotated about an axis parallel to the rotational axis of the work stage. In this apparatus, a semiconductor wafer is cooled during grinding. In order to perform cooling, the apparatus has an inlet flow path for guiding cooling liquid to a grinding surface of the grinding wheel, and an outlet flow path for collecting the cooling liquid which flows onto the work stage. The apparatus also includes a temperature detector, disposed in the outlet flow path, for detecting a temperature of the recovered cooling liquid. A rotational speed of the grinding wheel or the rotary table is controlled based on the temperature of the cooling liquid detected by the temperature detector.