HEATING DEVICE, FIXING DEVICE, AND IMAGE FORMING APPARATUS

    公开(公告)号:US20200292972A1

    公开(公告)日:2020-09-17

    申请号:US16750046

    申请日:2020-01-23

    IPC分类号: G03G15/20

    摘要: A heating device includes an endless rotator that rotates in a rotation direction. A heater contacts the endless rotator. An elastic body is disposed opposite an inner circumferential surface of the endless rotator and disposed downstream from the heater in the rotation direction of the endless rotator. A holder holds the heater and the elastic body. A pressure rotator is disposed opposite the heater and the elastic body via the endless rotator to form a nip between the endless rotator and the pressure rotator. A slide sheet covers a surface of the elastic body. The slide sheet includes an upstream end in the rotation direction of the endless rotator. The upstream end is sandwiched between the heater and the elastic body and between the elastic body and the holder. The upstream end is secured to the holder.

    HEATER, FIXING DEVICE, AND IMAGE FORMING APPARATUS

    公开(公告)号:US20200249601A1

    公开(公告)日:2020-08-06

    申请号:US16701686

    申请日:2019-12-03

    摘要: A heater includes a base and at least one resistive heat generator mounted on a face of the base. At least one electrode supplies power to the at least one resistive heat generator. A conductor couples the at least one electrode with the at least one resistive heat generator. A slide layer covers the at least one resistive heat generator and the conductor. The slide layer includes a projecting portion that defines a surface of the slide layer. The projecting portion is defined by a film thickness of at least one of the conductor and the at least one resistive heat generator. The projecting portion includes an upstream projection disposed opposite a lateral end of the base in a longitudinal direction of the base and a downstream projection disposed downstream from the upstream projection in a rotation direction of an endless belt that slides over the heater.

    HEATER, HEATING DEVICE, AND IMAGE FORMING APPARATUS

    公开(公告)号:US20210157259A1

    公开(公告)日:2021-05-27

    申请号:US17086764

    申请日:2020-11-02

    IPC分类号: G03G15/20 H05B3/02 H05B3/03

    摘要: A heater includes a first heat generator and a second heat generator each of which has a hypothetical center line that divides each of the first heat generator and the second heat generator into a first section and a second section. A first conductor connects a first electrode to the first heat generator and the second heat generator. A second conductor connects a second electrode to the first heat generator and the second heat generator. A first primary connector connects the first conductor to the first section of the first heat generator. A second primary connector connects the first conductor to the second section of the second heat generator. A first secondary connector connects the second conductor to the first heat generator. A second secondary connector connects the second conductor to the second heat generator.

    CONVERTER MODULE AND METHOD OF MANUFACTURING THE SAME
    10.
    发明申请
    CONVERTER MODULE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    转换器模块及其制造方法

    公开(公告)号:US20120025336A1

    公开(公告)日:2012-02-02

    申请号:US13268373

    申请日:2011-10-07

    IPC分类号: H01L29/80 H01L21/02

    CPC分类号: H04R19/005 G01F1/34

    摘要: To provide a converter module easily achieving miniaturization and profile reduction without decreasing the pressure detection sensitivity. The converter module includes: a converter which converts vibration of a diaphragm into an electric signal; and a semiconductor substrate which processes the electric signal obtained as a result of the conversion performed by the converter. The converter includes: a base including a cavity part having an opening in a front surface of the base; and the diaphragm which is arranged on the front surface to cover the opening of the cavity part and converts the vibration into the electric signal. The semiconductor substrate is formed as a part of the base.

    摘要翻译: 为了在不降低压力检测灵敏度的情况下提供易于实现小型化和轮廓缩减的转换器模块。 转换器模块包括:将振膜的振动转换为电信号的转换器; 以及处理由转换器执行的转换的结果而获得的电信号的半导体衬底。 所述转换器包括:基座,其包括在所述基座的前表面中具有开口的空腔部分; 以及隔膜,其布置在前表面上以覆盖空腔部分的开口,并将振动转换成电信号。 半导体衬底形成为基底的一部分。