THERMOELECTRIC MODULE AND METALLIZED SUBSTRATE
    2.
    发明申请
    THERMOELECTRIC MODULE AND METALLIZED SUBSTRATE 审中-公开
    热电模块和金属化基板

    公开(公告)号:US20100031989A1

    公开(公告)日:2010-02-11

    申请号:US12447762

    申请日:2007-10-22

    IPC分类号: H01L35/28

    摘要: A thermoelectric module (1) utilizing the Peltier effect, exhibiting an element-occupied area ratio of 40% or below, the element-occupied area ratio defined as the ratio of the sum of cross-sectional areas, perpendicular to the direction of electric current passage, of thermoelectric elements (5a,5b) to the area of insulating substrate (2a) being in contact with an object to be cooled via a metalized layer (4a), wherein metalized layers (4a,4b) are provided with slits. In this construction, there can be prevented breakage of thermoelectric device by thermal stress occurring at assembly, or thermal stress occurring at pre-tinning conducted in advance for attaching an object to be cooled or at attaching package, etc.

    摘要翻译: 利用珀耳帖效应的元件占有面积比为40%以下的热电模块(1)将元件占有面积比定义为垂直于电流方向的横截面积之和的比率 热电元件(5a,5b)通过金属化层(4a)与通过金属化层(4a)与要冷却的物体接触的绝缘基板(2a)的区域通过,其中金属化层(4a,4b)设置有狭缝。 在这种结构中,可以防止在组装时发生热应力而导致热电元件断裂,或者预先进行预镀锡时发生的热应力,以便附着待冷却物体或附接包装等。