公开(公告)号：US20170328864A1

公开(公告)日：2017-11-16

申请号：US15528013

申请日：2014-11-28

Applicant: HITACHI, LTD.

Inventor： Hisashi ENDOU ,  Hiroyuki TAKAGI ,  Taichi GOTO ,  Mitsuteru INOUE

IPC: G01N27/90

CPC classification number: G01N27/9046 ,  G01N27/83

Abstract: A defect inspection device configured to measure a surface shape of an inspection target using light applied to the inspection target via a spatial light phase modulator based on an interference state of reflected light from the inspection target obtained via the spatial light phase modulator, to measure magnetic field distribution of a surface of the inspection target magnetized by an excitation device for magnetizing the inspection target using light applied to the inspection target via the spatial light phase modulator based on an interference state of reflected light from the inspection target obtained via the spatial light phase modulator, and to separate data of a magnetic field specific portion which exists on the surface of the inspection target from magnetic field distribution data which is a measurement result of magnetic field distribution of the inspection target based on surface shape data which is a measurement result of the surface shape of the inspection target, to suppress deterioration of measurement accuracy of magnetic field distribution generated by the surface shape of the inspection target and to improve defect detection accuracy.

公开(公告)号：US20220057789A1

公开(公告)日：2022-02-24

申请号：US17413417

申请日：2020-01-30

Applicant: HITACHI, LTD.

Inventor： Masanori KITAOKA ,  Hisashi ENDOU ,  Nobuhiro KAKENO ,  Hiroshi YOSHIKAWA ,  Toshihiro YAMADA

IPC: G05B19/418

Abstract: A manufacturing monitoring assistance device includes: a model creation unit creating a computation model when a product as a sample is normal, based on a three-dimensional form acquired from the product; a simulation unit creating a corrective computation model when the product is abnormal, by adding a sample of an abnormal portion in the product to the created computation model, and performing a simulation on each of the computation model and the corrective computation model; and a monitoring method determination unit determining a method for monitoring a manufacturing process for the product, based on an abnormality index being a difference between an output from a sensor as a result of the simulation performed on the computation model and an output from a sensor as a result of the simulation performed on the corrective computation model, and causing an output device to display the determined method and the abnormality index.

公开(公告)号：US20180113077A1

公开(公告)日：2018-04-26

申请号：US15786770

申请日：2017-10-18

Applicant: Hitachi, Ltd.

Inventor： Ryoji NAKAGAWA ,  Hisashi ENDOU ,  Hiroshi YOSHIKAWA ,  Toshihiro YAMADA ,  Nobuhiro KAKENO

IPC: G01N21/88 ,  B23K37/04

Abstract: There are provided a welding monitoring system which can multidimensionally monitor a welding portion with high accuracy and a monitoring method thereof, by using a relatively simple configuration.There is provided a welding monitoring system which monitors a subject, including: a mechanical portion; and an imaging portion, in which the mechanical portion includes a transport arm which transports the subject, a subject holding portion which holds the subject, and an energizing device which causes welding with respect to the subject to be performed, and in which the imaging portion includes imaging means for obtaining imaging data of the subject, a data recording portion which records the imaging data, an analyzing portion which extracts predetermined characteristics from the imaging data, a comparison determination portion which compares the extracted characteristics and normal characteristics to each other to determine the presence or absence of abnormality, and a determination result output portion which outputs a determination result by the comparison determination portion.

公开(公告)号：US20210063316A1

公开(公告)日：2021-03-04

申请号：US16644155

申请日：2018-08-30

Applicant: HITACHI, LTD. ,  DAIKIN INDUSTRIES, LTD.

Inventor： Hisashi ENDOU ,  Masanori MIYAGI ,  Hiroshi YOSHIKAWA ,  Toshihiro YAMADA ,  Nobuhiro KAKENO ,  Yasunori HAMA

IPC: G01N21/892 ,  G01N25/72 ,  B23K31/12

Abstract: The disclosure provides a joining process line monitoring system capable of preventing joining quality deterioration and operation delay. A joining process line monitoring system 100 includes a joining phenomenon data acquisition part 111 configured to acquire a joining phenomenon of a joining subject member as phenomenon data; an operation state data acquisition part 112 configured to acquire a joining operation state of the joining subject member as operation state data; an evaluation data calculation unit 120 configured to perform time synchronization of the acquired phenomenon data and the acquired operation state data, and associate the acquired phenomenon data and the acquired operation state data with each joining operation location, so as to calculate evaluation data; a difference data extraction unit 130 configured to extract a difference between the evaluation data and reference data set in advance as difference data; an abnormal location determination unit 140 that determines that a portion having a large difference from the joining phenomenon is an abnormal location; and a presentation unit 150 configured to present the abnormal location of a joining portion of the joining subject member based on the difference data.

公开(公告)号：US20180321162A1

公开(公告)日：2018-11-08

申请号：US16032371

申请日：2018-07-11

Applicant: Hitachi, Ltd.

Inventor： Ryoji NAKAGAWA ,  Hisashi ENDOU ,  Hiroshi YOSHIKAWA ,  Toshihiro YAMADA ,  Nobuhiro KAKENO

IPC: G01N21/88 ,  B23K37/04

CPC classification number: G01N21/8806 ,  B23K31/125 ,  B23K37/04 ,  G01N2201/1053

Abstract: There are provided a welding monitoring system which can multidimensionally monitor a welding portion with high accuracy and a monitoring method thereof, by using a relatively simple configuration.There is provided a welding monitoring system which monitors a subject, including: a mechanical portion; and an imaging portion, in which the mechanical portion includes a transport arm which transports the subject, a subject holding portion which holds the subject, and an energizing device which causes welding with respect to the subject to be performed, and in which the imaging portion includes imaging means for obtaining imaging data of the subject, a data recording portion which records the imaging data, an analyzing portion which extracts predetermined characteristics from the imaging data, a comparison determination portion which compares the extracted characteristics and normal characteristics to each other to determine the presence or absence of abnormality, and a determination result output portion which outputs a determination result by the comparison determination portion.

公开(公告)号：US20180123477A1

公开(公告)日：2018-05-03

申请号：US15123212

申请日：2015-06-22

Applicant: HITACHI, LTD.

Inventor： Junichi SAKANO ,  Kimihisa FURUKAWA ,  Takashi OGAWA ,  Hisashi ENDOU

IPC: H02M7/539 ,  H02M1/32

CPC classification number: H02M7/539 ,  H02M1/32 ,  H02M7/48 ,  H02M7/53 ,  H02M2001/0009 ,  H02M2001/0012 ,  H02M2001/327

Abstract: There is provided a diagnostic system for a power converter which includes a semiconductor device, and performs a switching operation between conduction and interruption of the principal current flowing through the main circuit. The diagnostic system includes a current change amount calculation circuit for obtaining numeric data which reflects a current change amount of the principal current per unit time, a determination circuit for determining a state of the power converter by comparing the numeric data with a reference value, and an output circuit for outputting a determination result of the determination circuit.