公开(公告)号：US20030130806A1

公开(公告)日：2003-07-10

申请号：US10342871

申请日：2003-01-16

申请人： Hitachi, Ltd.

发明人： Fumio Mizuno ,  Seiji Isogai ,  Kenji Watanabe ,  Yasuhiro Yoshitake ,  Terushige Asakawa ,  Yuichi Ohyama ,  Hidekuni Sugimoto ,  Seiji Ishikawa ,  Masataka Shiba ,  Jun Nakazato ,  Makoto Ariga ,  Tetsuji Yokouchi ,  Toshimitsu Hamada ,  Ikuo Suzuki ,  Masami Ikota ,  Mari Nozoe ,  Isao Miyazaki ,  Yoshiharu Shigyo

IPC分类号： G01B005/28 ,  G01B005/30 ,  G06F019/00

CPC分类号： H01L22/20 ,  G01N21/9501 ,  G01R31/2894 ,  G01R33/06 ,  H01L2223/54466 ,  H01L2924/0002 ,  H01L2924/00

摘要： A process management system in accordance with the present invention includes inspection apparatuses for inspecting defects on a wafer, the inspection apparatuses being connected through a communication network, inspection information and image information obtained from these inspection apparatuses being collected to construct a data base and an image file, therein definition of defects is given by combinations of elements which characterize the defect based on the inspection information and the image information obtained from the inspection apparatuses. By giving definition of the defect, characteristics of the defect can be subdivided and known. Therefore, the cause of a defect can be studied.

摘要翻译： 根据本发明的处理管理系统包括用于检查晶片上的缺陷的检查装置，通过通信网络连接的检查装置，从这些检查装置获得的检查信息和图像信息被收集以构建数据库和图像 文件，其中缺陷的定义通过基于检查信息和从检查装置获得的图像信息来表征缺陷的元件的组合来给出。 通过给出缺陷的定义，可以细分和知道缺陷的特征。 因此，可以研究缺陷的原因。