公开(公告)号：US20030220754A1

公开(公告)日：2003-11-27

申请号：US10444981

申请日：2003-05-27

Applicant: Hitachi, Ltd.

Inventor： Hidemitsu Naya ,  Rikio Tomiyoshi ,  Shigeo Moriyama ,  Mutsumi Kikuchi ,  Kotaro Shimamura

IPC: G06F019/00

CPC classification number: H01L21/67225 ,  G03F7/70508 ,  G03F7/70991 ,  G05B19/418 ,  G05B19/41855 ,  G05B2219/31323 ,  G05B2219/31326 ,  G05B2219/45031 ,  H01L21/67276 ,  H04L67/1097 ,  Y02P90/185 ,  Y02P90/24 ,  Y02P90/265

Abstract: A semiconductor production system has a semiconductor manufacturing apparatus having an exposure unit, a control unit for controlling the exposure unit and a storage device; a semiconductor inspection apparatus having an observation unit, a control unit for controlling the observation unit and a storage device; and a storage device commonly used by the semiconductor manufacturing apparatus and the semiconductor inspection apparatus. The manufacturing apparatus, the inspection apparatus and the commonly used storage device are interconnected via a storage area network. With the semiconductor manufacturing apparatus and the storage device linked together via the storage area network, a large volume of image data or design data can be communicated at high speed, thus improving the system throughput.