Laser Powder Lamination Shaping Device, Laser Powder Lamination Shaping Method, and 3D Lamination Shaping Device
    1.
    发明申请
    Laser Powder Lamination Shaping Device, Laser Powder Lamination Shaping Method, and 3D Lamination Shaping Device 审中-公开
    激光粉层压成型装置,激光粉层压成型方法,3D层压成型装置

    公开(公告)号:US20160332370A1

    公开(公告)日:2016-11-17

    申请号:US15110517

    申请日:2014-10-22

    Applicant: Hitachi, Ltd.

    Abstract: Provided is a method capable of enhancing the quality (interlaminar strength, void reduction) of a lamination shaped article and using a high-heat resistant resin, and which has low cost and good quality and does not use a process window, and enhances release properties of a support. A laser powder shaping method for fabricating a lamination shaped article, the method having a step for providing a powder material as a thin layer and a laser irradiating step for irradiating the provided powder material with a laser and thereby sintering or melting the powder material, the laser powder shaping method characterized by having a step for performing a surface modification treatment for generating or increasing the number of oxygen functional groups in a region irradiated by the laser before or after the step for providing the powder material, or before or after the laser irradiation step.

    Abstract translation: 本发明提供一种能够提高层叠成型制品的质量(层间强度,空隙率降低)和使用高耐热性树脂的方法,其成本低,质量好,不使用工艺窗口,并且提高剥离性能 的支持。 一种用于制造层压成型制品的激光粉末成型方法,具有提供粉末材料作为薄层的步骤的方法和用激光照射所提供的粉末材料并由此烧结或熔化粉末材料的激光照射步骤, 激光粉末成形方法,其特征在于具有进行表面改性处理以在激光照射步骤之前或之后或在激光照射之前或之后产生或增加激光照射的区域中氧官能团数目的步骤 步。

    ULTRASONIC PROBE
    2.
    发明申请

    公开(公告)号:US20210353263A1

    公开(公告)日:2021-11-18

    申请号:US17189292

    申请日:2021-03-02

    Applicant: Hitachi, Ltd.

    Abstract: An ultrasonic probe has a transduction layer in which a plurality of transducers are placed, a backing layer provided at a rear side of the transduction layer with a wiring layer therebetween, and a plurality of heat dissipation members provided in the backing layer. The plurality of heat dissipation members extend in a line form in the backing layer, and are placed with an aligned direction of extension. An area occupancy percentage of the heat dissipation member at a center region of the backing layer is larger than that at an outer side of the center region. The center region is not positioned at ends of the cross section intersecting the direction of extension of the heat dissipation member, includes a center of gravity of the cross section, and occupies an area less than or equal to a half of an area of the cross section.

    ULTRASONIC DIAGNOSTIC DEVICE
    3.
    发明申请

    公开(公告)号:US20190183459A1

    公开(公告)日:2019-06-20

    申请号:US16326684

    申请日:2017-03-22

    Applicant: HITACHI, LTD.

    CPC classification number: A61B8/4444 A61B8/14 A61B8/461 A61B8/56

    Abstract: A probe 12 includes a laminated block 24 in which a protective layer 50, an acoustic matching layer 52, a vibrator array 20, a backing member 54, a relay board 56, and an IC 22 are laminated. A temperature sensor unit 26 is provided on a side surface of the laminated block 24. The temperature sensor unit 26 is provided with a metal film 60 provided in the vicinity of an edge on the front-side (the transmission/reception surface side) of the side surface of the laminated block 24, so as to extend along the front-side edge, and a thermistor 62 to detect a temperature of the metal film 60. The metal film 60 exerts a detection region expansion function of expanding a temperature detection region of the thermistor 62 in a direction where a temperature gradient occurs in the wave transmission/reception surface of the probe 12. Further, the metal film 60 also exerts a thermal diffusion function of diffusing heat of the wave transmission/reception surface of the probe 12.

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