ULTRASONIC PROBE
    2.
    发明申请

    公开(公告)号:US20210353263A1

    公开(公告)日:2021-11-18

    申请号:US17189292

    申请日:2021-03-02

    Applicant: Hitachi, Ltd.

    Abstract: An ultrasonic probe has a transduction layer in which a plurality of transducers are placed, a backing layer provided at a rear side of the transduction layer with a wiring layer therebetween, and a plurality of heat dissipation members provided in the backing layer. The plurality of heat dissipation members extend in a line form in the backing layer, and are placed with an aligned direction of extension. An area occupancy percentage of the heat dissipation member at a center region of the backing layer is larger than that at an outer side of the center region. The center region is not positioned at ends of the cross section intersecting the direction of extension of the heat dissipation member, includes a center of gravity of the cross section, and occupies an area less than or equal to a half of an area of the cross section.

    ULTRASONIC DIAGNOSIS DEVICE AND TEMPERATURE MANAGEMENT METHOD

    公开(公告)号:US20200170625A1

    公开(公告)日:2020-06-04

    申请号:US16628252

    申请日:2018-06-08

    Applicant: Hitachi, Ltd.

    Abstract: In order to estimate a temperature of a transmission-reception wavefront of a probe head, a first computing unit and a second computing unit are provided. The first computing unit estimates a temperature TA of the transmission-reception wavefront according to a basic function based on an internal temperature T1, an ambient temperature T2, power consumption Ptotal (=Pic+Ptd), and any other parameter. The basic function is a linear function. The second computing unit estimates a temperature TB of the transmission-reception wavefront according to an auxiliary function based on a previously estimated temperature Tpre, an internal temperature difference ΔT1, and any other, parameter. A selection unit selects any of the temperatures TA and TB depending on situations.

    ULTRASONIC DIAGNOSTIC DEVICE
    4.
    发明申请

    公开(公告)号:US20190183459A1

    公开(公告)日:2019-06-20

    申请号:US16326684

    申请日:2017-03-22

    Applicant: HITACHI, LTD.

    CPC classification number: A61B8/4444 A61B8/14 A61B8/461 A61B8/56

    Abstract: A probe 12 includes a laminated block 24 in which a protective layer 50, an acoustic matching layer 52, a vibrator array 20, a backing member 54, a relay board 56, and an IC 22 are laminated. A temperature sensor unit 26 is provided on a side surface of the laminated block 24. The temperature sensor unit 26 is provided with a metal film 60 provided in the vicinity of an edge on the front-side (the transmission/reception surface side) of the side surface of the laminated block 24, so as to extend along the front-side edge, and a thermistor 62 to detect a temperature of the metal film 60. The metal film 60 exerts a detection region expansion function of expanding a temperature detection region of the thermistor 62 in a direction where a temperature gradient occurs in the wave transmission/reception surface of the probe 12. Further, the metal film 60 also exerts a thermal diffusion function of diffusing heat of the wave transmission/reception surface of the probe 12.

    ULTRASONIC TRANSDUCER UNIT
    5.
    发明申请

    公开(公告)号:US20180040805A1

    公开(公告)日:2018-02-08

    申请号:US15551304

    申请日:2016-01-18

    Applicant: HITACHI, LTD.

    Abstract: A resonance layer (30) and an acoustic separation layer (34) are arranged adjacent to each other between a piezoelectric element (24) and a circuit board (16) provided with an electronic circuit for driving the piezoelectric element. The acoustic impedance of the resonance layer (30) is higher than that of the piezoelectric element (24), and the acoustic impedance of the acoustic separation layer (34) is lower than that of the circuit board (16). An ultrasonic wave is reflected at the interface between the resonance layer (30) and the acoustic separation layer (34) where the difference in acoustic impedance is large, and the ultrasonic wave propagating to the circuit-board (16) side is reduced.

    ULTRASONIC DIAGNOSTIC DEVICE
    6.
    发明申请
    ULTRASONIC DIAGNOSTIC DEVICE 审中-公开
    超声诊断装置

    公开(公告)号:US20170007213A1

    公开(公告)日:2017-01-12

    申请号:US15113677

    申请日:2014-10-24

    Applicant: HITACHI, LTD.

    Abstract: In the present invention, a wave transmission/reception unit is provided in the distal end of a probe. The wave transmission/reception unit includes a 2D-array oscillator, an electronic circuit, and a relay substrate for electrically joining the 2D-array oscillator and the electronic circuit. The face of the wave transmission/reception unit on a subject side thereof is a wave transmission/reception face. A temperature detection unit is provided to the relay substrate. In the present invention, a surface temperature estimation unit estimates the temperature of the surface of the wave transmission/reception face on the basis of the detected temperature from the temperature detection unit and the power consumption by the wave transmission/reception unit. Specifically, by separately taking into account the power consumption of the electronic circuit and the power consumption of the 2D-array oscillator, the temperature difference from a temperature detection location to the surface of the wave transmission/reception face is estimated, and the surface temperature is estimated from the detected temperature and the temperature difference.

    Abstract translation: 在本发明中,在探针的前端设有波发送接收部。 波发送/接收单元包括2D阵列振荡器,电子电路和用于将2D阵列振荡器和电子电路电连接的中继基板。 被摄体侧的波发送接收部的面是波发送接收面。 温度检测单元设置在继电器基板上。 在本发明中,表面温度估计单元基于来自温度检测单元的检测温度和波发送/接收单元的功率消耗来估计波发送/接收面的表面的温度。 具体地,通过分别考虑电子电路的功耗和2D阵列振荡器的功耗,估计从温度检测位置到波发送/接收面的表面的温度差,并且表面温度 根据检测温度和温差估算。

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