公开(公告)号：US20220252525A1

公开(公告)日：2022-08-11

申请号：US17594804

申请日：2019-05-15

Applicant: Hitachi High-Tech Corporation

Inventor： Taichi MAEDA ,  Yuko SASAKI

IPC: G01N21/95 ,  G01N23/2251 ,  G06T7/00

Abstract: The present invention addresses the problem of quickly specifying an optical condition of a wafer to be inspected, and in particular, accelerating optical condition setting after obtaining a customer wafer. An inspection apparatus automatic adjustment system according to the present invention comprises: an analysis condition setting interface 102 which inputs analysis conditions; an analysis execution unit 103 which performs analysis; an inspection device model and model DB 101 used for analysis; an analysis result DB 104 that stores analysis results; an observation condition setting interface 105 which inputs a wafer pattern, a focus point, an optimization index, and a priority; a wafer pattern search unit 106 which searches for a wafer pattern similar to the input wafer pattern; an optical condition extraction unit 107 which extracts, from the analysis result DB 104, the optimum optical condition for the similar wafer pattern and the focus point; and an optical condition setting unit 108 which generates a control signal corresponding to the optical condition and transmits the control signal to the inspection apparatus.