CHARGED PARTICLE BEAM APPARATUS
    1.
    发明公开

    公开(公告)号:US20230377837A1

    公开(公告)日:2023-11-23

    申请号:US18031359

    申请日:2020-10-26

    Abstract: Charged particle beam apparatus includes: a charged particle optical system to irradiate a sample with a pulsed charged particle beam; an optical system to irradiate the sample with light; a detector configured to detect a secondary charged particle emitted by irradiating the sample with the pulsed charged particle beam; a control unit configured to control the charged particle optical system to irradiate the sample with the pulsed charged particle beam under a predetermined electron beam pulse condition, and control the optical system to irradiate the sample with the light under a predetermined light irradiation condition; and a computation device configured to set the predetermined light irradiation condition based on a difference between a secondary charged particle signal amount detected under a first electron beam pulse condition and a secondary charged particle signal amount detected under a second electron beam pulse condition different from the first electron beam pulse condition.

    CHARGED PARTICLE BEAM INSPECTION SYSTEM AND CHARGED PARTICLE BEAM INSPECTION METHOD

    公开(公告)号:US20250095956A1

    公开(公告)日:2025-03-20

    申请号:US18728002

    申请日:2022-01-27

    Abstract: Provided is a charged particle beam inspection system that can derive an optimal observation condition using an image prediction model obtained by machine learning of simulation results. The charged particle beam inspection system includes: a charged particle beam irradiation device configured to acquire an image of a sample; and an observation condition search device configured to search for an observation condition of the charged particle beam irradiation device and control image acquisition performed by the charged particle beam irradiation device. The observation condition search device acquires a module including a learning device subjected to training using labeled training data, which includes a plurality of simulation images obtained by inputting image generation condition including a plurality of first device conditions and a plurality of first sample conditions into a simulator and the first image generation condition, sets a plurality of second device conditions in an image generation tool to acquire a plurality of output images output by the image generation tool, collates the plurality of output images with an image obtained by inputting the first sample condition and the second device condition to the learning device, and generates a second sample condition based on the collation result.

    Inspection Apparatus Adjustment System and Inspection Apparatus Adjustment Method

    公开(公告)号:US20220252525A1

    公开(公告)日:2022-08-11

    申请号:US17594804

    申请日:2019-05-15

    Abstract: The present invention addresses the problem of quickly specifying an optical condition of a wafer to be inspected, and in particular, accelerating optical condition setting after obtaining a customer wafer. An inspection apparatus automatic adjustment system according to the present invention comprises: an analysis condition setting interface 102 which inputs analysis conditions; an analysis execution unit 103 which performs analysis; an inspection device model and model DB 101 used for analysis; an analysis result DB 104 that stores analysis results; an observation condition setting interface 105 which inputs a wafer pattern, a focus point, an optimization index, and a priority; a wafer pattern search unit 106 which searches for a wafer pattern similar to the input wafer pattern; an optical condition extraction unit 107 which extracts, from the analysis result DB 104, the optimum optical condition for the similar wafer pattern and the focus point; and an optical condition setting unit 108 which generates a control signal corresponding to the optical condition and transmits the control signal to the inspection apparatus.

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