公开(公告)号：US20220244118A1

公开(公告)日：2022-08-04

申请号：US17562469

申请日：2021-12-27

Applicant: Hitachi Metals, Ltd. ,  NSK Ltd.

Inventor： Teruyuki NAKAMURA ,  Yuta SUGIYAMA ,  Yiming JIN ,  Kota FUKUDA

IPC: G01L3/10

Abstract: A magnetostrictive torque sensor includes detection coils formed around a magnetostrictive material made of chrome steel or chrome molybdenum steel, a magnetic ring configured to cover around the detection coils, and a drive unit for providing alternating current excitation to the detection coils at an excitation frequency of 50 kHz or more and 333 kHz or less. A torque applied to the magnetostrictive material is detected based on a change in inductance of the detection coils. The magnetic ring is configured by wrapping around the detection coils with an amorphous tape made of amorphous soft magnetic material in a tape shape. The thickness of the magnetic ring is 1.455 times or more as thick as a skin effect thickness of the magnetostrictive material and less than 1.000 mm.

公开(公告)号：US20220190580A1

公开(公告)日：2022-06-16

申请号：US17549205

申请日：2021-12-13

Applicant: Hitachi Metals, Ltd.

Inventor： Yoshinori KUBO ,  Akitoshi FUJIMORI ,  Yiming JIN

IPC: H02G15/18 ,  H02G3/00

Abstract: A harness member includes a cable, a housing with an insertion hole through which the cable is inserted, a heat-shrink tubing covering the housing and the cable exposed on one side from the insertion hole, and a hot melt adhesive to seal between the heat-shrink tubing and the cable and between the heat-shrink tubing and the housing. A recess is formed on the housing so as to be recessed from an outer circumferential surface covered with the heat-shrink tubing. At least a portion of the hot melt adhesive melted between the outer circumferential surface of the housing and an inner circumferential surface of the heat-shrink tubing has flowed into the recess.

公开(公告)号：US20220134618A1

公开(公告)日：2022-05-05

申请号：US17517389

申请日：2021-11-02

Applicant: Hitachi Metals, Ltd.

Inventor： Yiming JIN ,  Akitoshi FUJIMORI

IPC: B29C45/14 ,  G01L3/10

Abstract: A resin-sealed electronic component includes an electronic component main body sealed with a resin housing. The resin housing includes a pair of resin members aligned in a first direction with sandwiching a housing space housing the electronic component main body, and a sealing member including a molding resin and being molded so as to cover at least a portion of each of the pair of resin members. A portion of one resin member of the pair of resin members and a portion of the other resin member are aligned in a second direction intersecting the first direction to constitute a suppression structure that suppresses the molding resin from entering the housing space.