公开(公告)号：US07872487B2

公开(公告)日：2011-01-18

申请号：US12276572

申请日：2008-11-24

申请人： Holger Ross ,  Hubert Benzel ,  Roland Guenschel ,  Harald Guenschel

发明人： Holger Ross ,  Hubert Benzel ,  Roland Guenschel ,  Harald Guenschel

IPC分类号： G01R31/02 ,  G01R31/26

CPC分类号： H01L22/32 ,  H01L2924/0002 ,  H01L2924/00

摘要： In the measurement of sensor elements in a wafer composite, whereby non-electric stimuli are to be applied to the sensor elements, a semiconductor wafer having a multitude of sensor elements, each sensor element having a voltage supply connection, a grounded connection, and at least one sensor signal output, is configured such that a bus system is integrated in the semiconductor wafer, to which bus system at least the grounded connections of the sensor elements are connected and via which a supply voltage may be applied to the sensor elements, and that each sensor element is equipped with at least one controllable switching element for selecting the sensor element, so that only a selected sensor element supplies a sensor signal to a diagnosis device.

摘要翻译： 在晶片复合体中的传感器元件的测量中，由此将非电刺激施加到传感器元件，具有多个传感器元件的半导体晶片，每个传感器元件具有电压供应连接，接地连接和 至少一个传感器信号输出被配置为使得总线系统集成在半导体晶片中，至少连接传感器元件的接地连接的总线系统并且经由该总线系统可以将电源电压施加到传感器元件，以及 每个传感器元件配备有用于选择传感器元件的至少一个可控开关元件，使得仅一个选定的传感器元件将传感器信号提供给诊断装置。