公开(公告)号：US20250052905A1

公开(公告)日：2025-02-13

申请号：US18447148

申请日：2023-08-09

Applicant: Honeywell International Inc.

Inventor： Mikulas Jandak ,  Jan Pekarek ,  Zbynek Drasal ,  Viktor Drazan ,  Jan Popelka ,  Jan Oklestek

IPC: G01S17/95

Abstract: Various embodiments describe time-multiplexing of optical channels in an air data sensor. At least one switch outputs a reference optical signal, and each of a plurality of backscattered optical signals to at least one common optical path at a time. Alternatively stated, the at least one common optical path is configured to receive the reference optical signal and at least one of the backscattered optical signals in sequence. In doing so, the extent of systematic bias present in the at least one common optical path can be compensated for and even reduced during sensor operation.

公开(公告)号：US11650110B2

公开(公告)日：2023-05-16

申请号：US17089421

申请日：2020-11-04

Applicant: Honeywell International Inc.

Inventor： Zbynek Drasal ,  Jan Pekarek ,  Mikulas Jandak

IPC: G01L5/162 ,  B81B7/02 ,  G01L1/18

CPC classification number: G01L1/18 ,  B81B7/02 ,  G01L5/162 ,  B81B2201/0264

Abstract: Techniques relating to a micro-electro-mechanical (MEMS) device configured to measure direct axial and shear stress components of a stress tensor are described. The MEMS device includes a first and second circuit configured in a double rosette structure coupled with a third circuit in a standard rosette structure to form a triple rosette piezo-resistive gauge circuit. The first circuit includes at least one piezoresistive element suspended from a substrate, and at least one piezoresistive element fixed to the substrate. The second circuit includes each piezoresistive element fixed to the substrate. The third circuit includes at least one piezoresistive element fixed to the substrate. Additionally, the MEMS device may be coupled to one or more processing systems to determine a mechanical stress tensor that is applied to the MEMS device based on measurements received from the MEMS device.

公开(公告)号：US20220136913A1

公开(公告)日：2022-05-05

申请号：US17089421

申请日：2020-11-04

Applicant: Honeywell International Inc.

Inventor： Zbynek Drasal ,  Jan Pekarek ,  Mikulas Jandak

IPC: G01L1/18 ,  G01L5/162 ,  B81B7/02

Abstract: Techniques relating to a micro-electro-mechanical (MEMS) device configured to measure direct axial and shear stress components of a stress tensor are described. The MEMS device includes a first and second circuit configured in a double rosette structure coupled with a third circuit in a standard rosette structure to form a triple rosette piezo-resistive gauge circuit. The first circuit includes at least one piezoresistive element suspended from a substrate, and at least one piezoresistive element fixed to the substrate. The second circuit includes each piezoresistive element fixed to the substrate. The third circuit includes at least one piezoresistive element fixed to the substrate. Additionally, the MEMS device may be coupled to one or more processing systems to determine a mechanical stress tensor that is applied to the MEMS device based on measurements received from the MEMS device.