公开(公告)号：US10197588B2

公开(公告)日：2019-02-05

申请号：US15347670

申请日：2016-11-09

Applicant: Honeywell International Inc.

Inventor： Yates Wong ,  Grant A. Gordon ,  Nicholas A Everson ,  Morris G. Anderson

IPC: G01P5/165 ,  G01F1/46 ,  G01K13/02 ,  G01P13/02 ,  H05B3/34

Abstract: An air data probe is provided. The air data probe comprises an inner body having an outer surface, an outer body having an inner surface, a thin film heating system having a first surface and a second surface, a first thermally conductive adhesive disposed between the first surface and the outer surface, a second thermally conductive adhesive disposed between the second surface and the inner surface; and wherein the thin film heating system comprises one or more thin film heaters having one or more heating elements disposed in a thermally conductive, electrical insulator.