公开(公告)号：US20190078007A1

公开(公告)日：2019-03-14

申请号：US16105456

申请日：2018-08-20

申请人： Honeywell International Inc.

发明人： Liqiang Zhang ,  Huifeng Duan ,  Rongwei Pan ,  Qi Zhang ,  Ya Qun Liu ,  Haigang Kang

IPC分类号： C09K5/14 ,  C08L71/02

摘要： The present disclosure provides a silicone free gel that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes a polyether polyol, a cross-linker, a coupling agent, an antioxidant, a catalyst, and at least one thermally conductive filler.

公开(公告)号：US11041103B2

公开(公告)日：2021-06-22

申请号：US16105456

申请日：2018-08-20

申请人： Honeywell International Inc.

发明人： Liqiang Zhang ,  Huifeng Duan ,  Rongwei Pan ,  Qi Zhang ,  Ya Qun Liu ,  Haigang Kang

IPC分类号： C09K5/14 ,  C08L71/02

摘要： The present disclosure provides a silicone free gel that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes a polyether polyol, a cross-linker, a coupling agent, an antioxidant, a catalyst, and at least one thermally conductive filler.