公开(公告)号：US20190327848A1

公开(公告)日：2019-10-24

申请号：US16384667

申请日：2019-04-15

申请人： Honeywell International Inc.

发明人： Yi Zheng ,  Xiaohui Qin ,  Xinyan Zheng ,  Li Chen ,  Qingyong Zhang ,  Qian Liu ,  Cary Leen ,  Roy Kolasa ,  Andrew Halford

IPC分类号： H05K7/14 ,  H02G3/16 ,  H01R13/66 ,  H01R12/72 ,  H01R31/06

摘要： Methods, devices, and systems for a hardware adapter device are described herein. One device includes housing, a plurality of printed circuit boards (PCBs) housed by the housing, where each of the plurality of PCBs include traces, and a switch to select a bus address corresponding to the hardware adapter device, where the housing receives an input/output (I/O) module such that the traces of the PCBs provide an electrical path from a wiring baseboard to the I/O module.

公开(公告)号：US10356929B1

公开(公告)日：2019-07-16

申请号：US15958600

申请日：2018-04-20

申请人： Honeywell International Inc.

发明人： Yi Zheng ,  Xiaohui Qin ,  Xinyan Zheng ,  Li Chen ,  Qingyong Zhang ,  Qian Liu ,  Cary Leen ,  Roy Kolasa ,  Andrew Halford

IPC分类号： H05K7/14 ,  H02G3/16 ,  H01R13/66 ,  H01R31/06 ,  H01R12/72

摘要： Methods, devices, and systems for a hardware adapter device are described herein. One device includes housing, a plurality of printed circuit boards (PCBs) housed by the housing, where each of the plurality of PCBs include traces, and a switch to select a bus address corresponding to the hardware adapter device, where the housing receives an input/output (I/O) module such that the traces of the PCBs provide an electrical path from a wiring baseboard to the I/O module.