公开(公告)号：US20140242407A1

公开(公告)日：2014-08-28

申请号：US14345392

申请日：2013-03-25

申请人： Hong Wang ,  Zhaoyu Wang ,  Ping Cheng ,  Guifu Ding ,  Ting Gu ,  Huiying Wang ,  Congchun Zhang

发明人： Hong Wang ,  Zhaoyu Wang ,  Ping Cheng ,  Guifu Ding ,  Ting Gu ,  Huiying Wang ,  Congchun Zhang

IPC分类号： B81C1/00

CPC分类号： B81C1/00111 ,  B81C2201/032 ,  G01N3/08 ,  G01N2203/0298 ,  Y10T428/12389

摘要： An in-situ compressed specimen of copper interconnection micro column, which is a circular metal column formed in a PDMS hole, includes: a specimen part and a fixed end part for fixing the specimen; wherein the fixed end part is a circular or square plate structure, the specimen part is an upper part of the fixed end part; a main body of the present invention is of micron order, a forced direction of the specimen is consistent with a growth direction of the metal column. A method of electroplating copper column by adopting PDMS as template substrate is applied to overcome a problem that TSV is corrosive to the copper column during a silicon etching process so as to affect a mechanical property accuracy test, the method is advanced in shortening test process period, achieving good reproducibility and high yield.

摘要翻译： 在PDMS孔中形成的圆形金属柱的铜互连微柱的原位压缩样品包括：样品部分和用于固定样品的固定端部; 所述固定端部为圆形或方形板状结构，所述检体部为所述固定端部的上部; 本发明的主体是微米级的，试样的强制方向与金属柱的生长方向一致。 应用PDMS作为模板基板电镀铜柱的方法，以克服在硅蚀刻过程中TSV对铜柱腐蚀的问题，从而影响机械性能精度试验，该方法在缩短试验过程周期 ，实现良好的再现性和高产量。