Method for Electrochemical Fabrication
    3.
    发明申请
    Method for Electrochemical Fabrication 审中-公开
    电化学加工方法

    公开(公告)号:US20100264037A1

    公开(公告)日:2010-10-21

    申请号:US12789704

    申请日:2010-05-28

    申请人: Adam L. Cohen

    发明人: Adam L. Cohen

    IPC分类号: C25D5/02

    摘要: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

    摘要翻译: 一种电镀方法,包括:a)使第一衬底与第一制品接触,所述第一制品包括衬底和以衬底形式设置的贴合掩模; b)以第一图案将来自金属离子源的第一金属电镀到所述第一基板上,所述第一图案对应于所述适形掩模图案的所述补体; 和c)从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。

    Method for electrochemical fabrication
    4.
    发明授权
    Method for electrochemical fabrication 失效
    电化学制造方法

    公开(公告)号:US07618525B2

    公开(公告)日:2009-11-17

    申请号:US11927287

    申请日:2007-10-29

    申请人: Adam L. Cohen

    发明人: Adam L. Cohen

    IPC分类号: C25D5/02

    摘要: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

    摘要翻译: 一种电镀方法,包括:a)使第一衬底与第一制品接触,所述第一制品包括衬底和以衬底形式设置的贴合掩模; b)以第一图案将来自金属离子源的第一金属电镀到所述第一基板上,所述第一图案对应于所述适形掩模图案的所述补体; 和c)从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。

    Method for manufacturing metal microstructure
    5.
    发明授权
    Method for manufacturing metal microstructure 失效
    制造金属微观结构的方法

    公开(公告)号:US07338753B2

    公开(公告)日:2008-03-04

    申请号:US11503303

    申请日:2006-08-14

    IPC分类号: G03F7/039

    摘要: A method of manufacturing a metal microstructure (1) by using a resin mold (13). In order to provide a method in which a mild manufacturing condition which causes less damage to the resin mold (13) can be set and the high-precision metal microstructure (1) can be mass-produced by uniform electroforming, the method of manufacturing the metal microstructure (1) according to the present invention includes the steps of: fixing on a conductive substrate (11) the resin mold (13) having a vacant portion penetrating in the direction of thickness, by interposing a photosensitive polymer (12) having a chemical composition changed by an electron beam, ultraviolet radiation or visible radiation so as to form a layered structure (2) having the resin mold (13); exposing the layered structure (2) having the resin mold (13) to an electron beam, ultraviolet radiation or visible radiation; removing an exposed photosensitive polymer (12c) existing at the vacant portion of the resin mold (13); and filling with a metal (14) the vacant portion of the layered structure (2) having the resin mold (13) by electroforming.

    摘要翻译: 一种通过使用树脂模具(13)制造金属微结构(1)的方法。 为了提供可以设定对树脂模具(13)造成较小损害的温和制造条件并且可以通过均匀电铸来大量生产高精度金属微结构(1)的方法,制造 根据本发明的金属微结构(1)包括以下步骤:通过插入具有一个或多个金属微结构(1)的光敏聚合物(12)将具有穿过厚度方向的空白部分的树脂模具(13)固定在导电基板(11)上, 化学成分由电子束,紫外线辐射或可见光辐射而变化,形成具有树脂模具(13)的层状结构(2)。 将具有树脂模具(13)的层状结构(2)暴露于电子束,紫外线或可见光; 去除存在于树脂模具(13)的空缺部分的暴露的光敏聚合物(12c); 并通过电铸将金属(14)填充到具有树脂模具(13)的层状结构(2)的空位部分上。

    Method For Electrochemical Fabrication
    6.
    发明申请
    Method For Electrochemical Fabrication 审中-公开
    电化学制造方法

    公开(公告)号:US20070181430A1

    公开(公告)日:2007-08-09

    申请号:US11622279

    申请日:2007-01-11

    申请人: Adam Cohen

    发明人: Adam Cohen

    IPC分类号: C25D5/02

    摘要: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

    摘要翻译: 一种电镀方法,包括:a)使第一衬底与第一制品接触,所述第一制品包括衬底和以衬底形式设置的贴合掩模; b)以第一图案将来自金属离子源的第一金属电镀到所述第一基板上,所述第一图案对应于所述适形掩模图案的所述补体; 和c)从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。

    Stamper-forming electrode material, stamper-forming thin film, and method of manufacturing optical disk
    8.
    发明申请
    Stamper-forming electrode material, stamper-forming thin film, and method of manufacturing optical disk 审中-公开
    压模形成用电极材料,压模成形薄膜及其制造方法

    公开(公告)号:US20020153625A1

    公开(公告)日:2002-10-24

    申请号:US10061222

    申请日:2002-02-04

    IPC分类号: B29D011/00

    摘要: A stamper-forming electrode material contains Ag as its main ingredient and at least one other element, preferably Au and/or Cu. It is preferred that the Au and Cu contents each be 5.0 wt % or less. A stamper-forming thin film is made of this stamper-forming electrode material, whereby its corrosion resistance is improved to suppress damage to itself, and a high-quality stamper can hence be formed.

    摘要翻译: 压模形成电极材料包含Ag作为其主要成分和至少一种其它元素,优选Au和/或Cu。 Au和Cu的含量优选为5.0重量%以下。 压模形成薄膜由该压模形成用电极材料制成,由此其耐腐蚀性得到改善以抑制其自身的损坏,因此可以形成高质量的压模。

    Method for forming a filter
    10.
    发明授权
    Method for forming a filter 失效
    形成过滤器的方法

    公开(公告)号:US5985164A

    公开(公告)日:1999-11-16

    申请号:US950952

    申请日:1997-10-15

    摘要: Surface micromachining and bulk micromachining are employed for realizing a porous membrane with bulk support for a microparticle filter. The filter is manufactured by a process employing a thin film etch-stop, in which the bulk substrate is etched using a first etching process followed by etching of the etch stop and of material within pores of a filter layer using a second etching process. The filter is sufficiently sturdy to allow for easy handling. It may be used as a diffusion barrier and under high pressures. The disclosed fabrication method is simple, reliable, and integrated-circuit compatible, and thus amenable to mass production. Electronic circuitry may be integrated on the filter surface, as may be desired for several purposes, such as fluid characterization, filter self-cleaning, or charging of the filter surfaces. Methods are shown for the realization of biological containment capsules based on this microfilter.

    摘要翻译: 采用表面微机械加工和体积微加工技术来实现具有大量支撑微孔过滤器的多孔膜。 该过滤器是通过使用薄膜蚀刻停止的工艺制造的,其中使用第一蚀刻工艺蚀刻大块衬底,然后使用第二蚀刻工艺蚀刻蚀刻停止层和过滤层的孔内的材料。 过滤器足够坚固以便于处理。 它可以用作扩散屏障并在高压下使用。 所公开的制造方法简单,可靠,并且集成电路兼容,因此适合批量生产。 电子电路可以集成在过滤器表面上,如可能需要多种目的,例如流体表征,过滤器自清洁或过滤表面的充电。 显示了基于该微型过滤器实现生物遏制胶囊的方法。