公开(公告)号：US20240292581A1

公开(公告)日：2024-08-29

申请号：US18044687

申请日：2022-08-22

Applicant: Honor Device Co., Ltd.

Inventor： Jianqiang Guo ,  Wenjun Luo ,  Jun Li

IPC: H05K9/00 ,  H05K1/14 ,  H05K1/18

CPC classification number: H05K9/0032 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/10371 ,  H05K2201/10545

Abstract: Embodiments of this application provide a circuit board assembly and an electronic device. The circuit board assembly includes: a first circuit board and a second circuit board stacked with the first circuit board, where the first circuit board is provided with a first shielding frame on a surface facing toward the second circuit board, the second circuit board is provided with a second shielding frame on a surface facing toward the first circuit board, and opposite end portions of the first shielding frame and the second shielding frame are connected to a shared shielding cover, so that the shared shielding cover, the first shielding frame, and the second shielding frame enclose a shielding cavity.