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Patent Agency Ranking
公开(公告)号：US12219727B2
公开(公告)日：2025-02-04
申请号：US18025470
申请日：2022-08-18
Applicant: HONOR DEVICE CO., LTD.
Inventor： Jianqiang Guo , Wenjun Luo , Fan Yang
Abstract: Embodiments of this application provide a circuit board assembly and an electronic device. The circuit board assembly includes at least a frame plate, circuit boards, support bodies, and solder joints. The frame plate includes a frame body and first pads provided on the frame body. The circuit boards each are provided on one side of the frame plate. The circuit board includes a board body and second pads provided on the board body. The support bodies are provided between the frame plate and the circuit boards. The support bodies each include a first support portion and a second support portion. The first support portion is connected to the frame body. The second support portion is connected to the board body. Solder joints are provided between the first pads and the second pads. The solder joints connect the first pads to the second pads.
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公开(公告)号：US20240292581A1
公开(公告)日：2024-08-29
申请号：US18044687
申请日：2022-08-22
Applicant: Honor Device Co., Ltd.
Inventor： Jianqiang Guo , Wenjun Luo , Jun Li
CPC classification number: H05K9/0032 , H05K1/144 , H05K1/181 , H05K2201/10371 , H05K2201/10545
Abstract: Embodiments of this application provide a circuit board assembly and an electronic device. The circuit board assembly includes: a first circuit board and a second circuit board stacked with the first circuit board, where the first circuit board is provided with a first shielding frame on a surface facing toward the second circuit board, the second circuit board is provided with a second shielding frame on a surface facing toward the first circuit board, and opposite end portions of the first shielding frame and the second shielding frame are connected to a shared shielding cover, so that the shared shielding cover, the first shielding frame, and the second shielding frame enclose a shielding cavity.
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公开(公告)号：US20240306300A1
公开(公告)日：2024-09-12
申请号：US18000891
申请日：2022-08-18
Applicant: HONOR DEVICE CO., LTD.
Inventor： Jianqiang Guo , Wenjun Luo , Mingchuan Li
CPC classification number: H05K1/118 , H01R12/62 , H05K2201/09481 , H05K2201/09572 , H05K2201/09854
Abstract: A flexible circuit board, a circuit board assembly, and an electronic device are provided. The flexible circuit board includes at least a flexible dielectric layer and a first connection metal layer. The flexible dielectric layer includes a through hole extending along a thickness direction of the flexible dielectric layer. The through hole includes a middle basic hole and outer auxiliary holes. Two or more outer auxiliary holes are distributed and arranged along a circumferential direction of the middle basic hole. The middle basic hole is in communication with the two or more outer auxiliary holes. The first connection metal layer is arranged on an inner wall of the through hole and is connected to the flexible dielectric layer. The first connection metal layer includes a middle channel extending along a thickness direction.
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公开(公告)号：US12237566B2
公开(公告)日：2025-02-25
申请号：US17778354
申请日：2021-04-13
Applicant: Honor Device Co., Ltd.
Inventor： Jianqiang Guo , Liang Bai , Lianjie Ye , Wenjun Luo , Zhihai Li
Abstract: The electronic device includes a frame, a screen, and a circuit board assembly. A part of the frame forms a radiator of an antenna, or the radiator of the antenna is fixed on an inner side of the frame. The circuit board assembly is located on the inner side of the frame. The circuit board assembly includes a first conductive member, and a first board, an elevating board, and a second board sequentially stacked. The first board is located on one side of the second board away from the screen. The first board includes a first main body portion and a first extension portion connected to the first main body portion. The first main body portion is fixedly connected to the elevating board. The first extension portion protrudes relative to the elevating board and the second board, and is disposed close to the radiator.
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公开(公告)号：US20240244752A1
公开(公告)日：2024-07-18
申请号：US18004227
申请日：2022-08-18
Applicant: Honor Device Co., Ltd.
Inventor： Jianqiang Guo , Wenjun Luo
CPC classification number: H05K1/148 , H05K1/118 , G06F1/183 , H05K2201/042
Abstract: A circuit board assembly that is applied to an electronic device is provide. The circuit board assembly includes at least printed circuit boards, a flexible circuit board, and a support. Two or more printed circuit boards are spaced apart. The printed circuit boards include first pads. Two neighboring printed circuit boards are connected to the flexible circuit board. The flexible circuit board includes a bending region, straight regions, and second pads. Straight regions are respectively arranged on two opposite sides of the bending region. The straight regions are located between the two printed circuit boards. The bending region and the straight regions form an accommodating space. The second pad is arranged in the straight region. The first pad is connected to the second pad. The support is arranged in the accommodating space. The support includes two stacked support bodies.
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