公开(公告)号：US20240019367A1

公开(公告)日：2024-01-18

申请号：US18037125

申请日：2022-08-25

Applicant: Honor Device Co., Ltd.

Inventor： Ye Lv ,  Xiujuan Yang

IPC: G01N21/55 ,  B23K1/008 ,  G01B11/06

CPC classification number: G01N21/55 ,  B23K1/008 ,  G01B11/06

Abstract: A substrate is placed in a reflow oven, where a solder flux volatilized in the reflow oven is capable of adhering to a surface of the substrate to form a solder flux layer, a thickness of the solder flux layer is detected, and a concentration of the solder flux in the reflow oven is calculated based on the thickness of the solder flux layer.