公开(公告)号：US12096580B2

公开(公告)日：2024-09-17

申请号：US17912685

申请日：2022-01-05

Applicant: Honor Device Co., Ltd.

Inventor： Xiujuan Yang ,  Wenhao Wang ,  Mingchuan Li

IPC: H05K5/06 ,  H04R1/10 ,  H05K5/00 ,  H05K5/02

CPC classification number: H05K5/06 ,  H04R1/1016 ,  H04R1/1075 ,  H05K5/0026 ,  H05K5/0226

Abstract: A waterproof electronic device includes a shell, a first electronic module, a second electronic module, and a flexible printed circuit FPC. A first compartment and a second compartment which are in communication with each other through a through hole are formed in the shell. The through hole is used for the FPC to pass through. The first and second electronic module are arranged in the first and second compartment respectively. The first electronic module is coupled to the second electronic module by the FPC which passes through the through hole. An opening in communication with the through hole is provided on the shell. A magnetic colloidal structure is arranged in the through hole, where the magnetic colloidal structure seals the through hole.

公开(公告)号：US20240314234A1

公开(公告)日：2024-09-19

申请号：US18028086

申请日：2022-08-30

Applicant: Honor Device Co., Ltd.

Inventor： Xiujuan Yang ,  Mingchuan Li ,  Wenhao Wang

IPC: H04M1/02

CPC classification number: H04M1/0277 ,  H04M1/022

Abstract: An electronic device includes a first body, a second body, a middle cover, and a flexible printed circuit. The flexible printed circuit includes a through-shaft section, a reinforcing plate is provided on a surface of the through-shaft section, the reinforcing plate includes a support sheet and a flexible region, and the support sheet is stacked on and fastened to a surface of the through-shaft section. The flexible region is provided on the support sheet or divides the support sheet into a plurality of sheet bodies. The first body and the second body are rotatably connected to two opposite sides of the middle cover, respectively. The flexible printed circuit extends from the first body to the second body, to connect the first body and the second body, and the reinforcing plate is located in the middle cover and is fastened to the middle cover.

公开(公告)号：US12265118B2

公开(公告)日：2025-04-01

申请号：US18008378

申请日：2022-08-19

Applicant: HONOR DEVICE CO., LTD.

Inventor： Ruifei Wang ,  Wenhao Wang ,  Xiujuan Yang

IPC: G01R31/28

Abstract: A flexible circuit board test device is disclosed. The flexible circuit board test device includes a main clamp, a first rotating shaft arm and a second rotating shaft arm; the first rotating shaft arm and the second rotating shaft arm are rotatably mounted on a first mobile table and a second mobile table through a first main shaft and a second main shaft respectively; the first rotating shaft arm and the second rotating shaft arm each are provided with a sandwich space for simulating a motion space of a flexible circuit board; the first mobile table is provided with a first driving component in transmission connection with the first main shaft, the second mobile table is provided with a second driving component in transmission connection with the second main shaft; and the first rotating shaft arm and the second rotating shaft arm are provided with auxiliary clamps.

公开(公告)号：US20250168262A1

公开(公告)日：2025-05-22

申请号：US18839372

申请日：2023-04-11

Applicant: Honor Device Co., Ltd.

Inventor： Wenhao Wang ,  Yihe Zhang ,  Xiujuan Yang ,  Ye Han

IPC: H04M1/02

Abstract: Embodiments of this application provide a foldable electronic device and a shaft cover assembly. A first middle frame part and a second middle frame part in the foldable electronic device are rotatably connected to each other by using a rotating shaft assembly. The foldable electronic device further includes a flexible circuit board and at least one shaft cover assembly. The shaft cover assembly is rotatably connected to the rotating shaft assembly. The flexible circuit board is fixedly connected to the shaft cover assembly. In a process in which the first middle frame part and the second middle frame part are folded or unfolded relative to each other, the shaft cover assembly moves back and forth relative to the rotating shaft assembly in a thickness direction of the foldable electronic device.

公开(公告)号：US20240019367A1

公开(公告)日：2024-01-18

申请号：US18037125

申请日：2022-08-25

Applicant: Honor Device Co., Ltd.

Inventor： Ye Lv ,  Xiujuan Yang

IPC: G01N21/55 ,  B23K1/008 ,  G01B11/06

CPC classification number: G01N21/55 ,  B23K1/008 ,  G01B11/06

Abstract: A substrate is placed in a reflow oven, where a solder flux volatilized in the reflow oven is capable of adhering to a surface of the substrate to form a solder flux layer, a thickness of the solder flux layer is detected, and a concentration of the solder flux in the reflow oven is calculated based on the thickness of the solder flux layer.