公开(公告)号：US5564490A

公开(公告)日：1996-10-15

申请号：US428805

申请日：1995-04-24

申请人： Howard H. Liebermann ,  David F. Teller

发明人： Howard H. Liebermann ,  David F. Teller

IPC分类号： B22D11/06 ,  B22D27/04

CPC分类号： B22D11/0648

摘要： A quench substrate for rapid solidification of molten alloy into strip has a microcrystalline or amorphous structure. The substrate is composed of a thermally conducting alloy and the structure is substantially homogeneous. The substrate is a thermal conducting material such as copper or a copper alloy, and has a constituent grain size uniformity greater than 1 .mu.m and less than 1,000 .mu.m in size.

摘要翻译： 用于将熔融合金快速凝固成条的骤冷基板具有微晶或非晶结构。 基板由导热合金构成，该结构基本上是均匀的。 基板是诸如铜或铜合金的导热材料，并且其尺寸均匀度大于1μm，小于1,000μm。