Method and apparatus for cooling electronics
    1.
    发明授权
    Method and apparatus for cooling electronics 有权
    冷却电子元件的方法和装置

    公开(公告)号:US07796389B2

    公开(公告)日:2010-09-14

    申请号:US12324757

    申请日:2008-11-26

    IPC分类号: H05K7/20

    摘要: Embodiments of the present disclosure provide for methods and devices for improving the heat dissipating properties of a heatsink to provide increased cooling for electronic equipment, such as power converters. In one embodiment, a heatsink includes at least one fluid cooled portion and at least one heat pipe disposed adjacent to the fluid cooled portion. The heat pipe improves the conduction of heat away from heat sources.

    摘要翻译: 本公开的实施例提供了用于改善散热器的散热特性以为电子设备(例如功率转换器)提供增加的冷却的方法和装置。 在一个实施例中,散热器包括至少一个流体冷却部分和邻近流体冷却部分设置的至少一个热管。 热管改善了热源远离热源的传导。

    METHOD AND APPARATUS FOR COOLING ELECTRONICS
    2.
    发明申请
    METHOD AND APPARATUS FOR COOLING ELECTRONICS 有权
    冷却电子的方法和装置

    公开(公告)号:US20100128436A1

    公开(公告)日:2010-05-27

    申请号:US12324757

    申请日:2008-11-26

    IPC分类号: H05K7/20 F28D15/00

    摘要: Embodiments of the present disclosure provide for methods and devices for improving the heat dissipating properties of a heatsink to provide increased cooling for electronic equipment, such as power converters. In one embodiment, a heatsink includes at least one fluid cooled portion and at least one heat pipe disposed adjacent to the fluid cooled portion. The heat pipe improves the conduction of heat away from heat sources.

    摘要翻译: 本公开的实施例提供了用于改善散热器的散热特性以为电子设备(例如功率转换器)提供增加的冷却的方法和装置。 在一个实施例中,散热器包括至少一个流体冷却部分和邻近流体冷却部分设置的至少一个热管。 热管改善了热源远离热源的传导。